News Details
Resin powder coatings crosslinking agent
2017-4-24 18:31:19
Resin powder coatings crosslinking agent,By lowering the resin itself to melting temperature, viscosity, softening point and increase the functional group increase the crosslinking degree of the resin, additives are added, apply the appropriate catalyst and other means to realize low temperature crosslinking of powder coatings. Reduce the crosslinking temperature of powder coating, not only can increase the production rate of automatic production line and improve the production efficiency, save energy, and make the application range of the powder coating greatly increased.
Decided to powder coating performance is the key to the matrix resin, to realize low temperature crosslinking of powder coatings, has now developed the unsaturated polyester, unsaturated acrylic resin, polyurethane acrylate resin, vinyl ether resin, etc. These new (Allnex) and DSM (DSM) have corresponding products.
Unsaturated resin is UV crosslinking or free radical thermal crosslinking powder coating the main film-forming material, is to determine the main components of the coatings properties and film performance.
To realize low temperature crosslinking, good storage stability, on the one hand, the resin can is required to give powder, powder shall be under the condition of 40 ℃ can be stored 3 ~ 6 months without agglomeration; On the other hand, the raw materials used shall be at low temperature (100 ℃ or less) under a low melt viscosity to ensure that the coating has good liquidity in the process of crosslinking.
This requires that the selected resin glass transition temperature (Tg) should be in 50 ~ 70 ℃ (at least in more than 40 ℃), average molecular weight of 1000 ~ 4000, and to narrow molecular weight distribution.
To get this resin is not easy, Tg above 50 ℃ resin melt is difficult to control, because C = C double bond at 80 ℃ can begin aggregation, and under 80 ℃, the viscosity is too high and difficult to handle. Commonly used method to reduce resin melt temperature is semicrystalline resin synthesis, join the crystalline compound, or amorphous oligomer.
Chinese name: Diethyl toluene diamine(DETDA)
Chinese alias: aryl, aryl diethyl - aryl - methyl-p-phenylenediamine
English name: Benzenediamine, ar, ar-diethyl-ar-methyl-English aliases:Diethyltoluenediamine; ar, ar-Diethyl-ar-methylbenzenediamine;Diethylmethylbenzenediamine;
CAS No. :68479-98-1
EINECS No. :270 -877-4
Molecular formula: C11H18N2
Molecular Weight: 178.28
Boiling point: 310 ℃
Refractive index: 1.581
Flash Point: > 140 ℃
Inchi: InChI = 1/C11H18N2/c1-4-8-6-7 (3) 10 (12) 11 (13) 9 (8) 5-2/h6H ,4-5,12-13H2 ,1-3H3 density : 1.022
Risk Codes: R10; R35
RIDADR: UN 3082
Safety instructions: S2; S26; S39; S61
Packing Group: III
Hazard Class: 6.1
By dendritic polymer structure design, synthesis and preparation of hyperbranched semicrystalline polymer cross-linked unsaturated resin at low temperature is also a kind of feasible method.
From the perspective of physical chemistry can be applied to consider the chemical reaction rate Arrhenius formula (Arrhenius), said k = Aexp - Ea/RT (exponential). As the rate constant, k R for molar gas constant, T for thermodynamic temperature, Ea as the apparent activation energy, A is refers to the former factor (also called frequency factor), is also commonly used another form: LNK = lnA - Ea/RT (log).
To improve the low temperature crosslinking reaction rate, can be analysis from its chemical reaction mechanism. It can be seen that the Ea for the apparent activation energy is a very important factor, activation energy is refers to the chemical reaction, the reactant molecules to reach the minimum energy required to activate molecular. Closely related to the size of the chemical reaction rate and activation energy, the lower the activation energy, the faster the reaction rate, thus reduces the activation energy will effectively promote the reaction.
Promoter by lowering the activation energy (which is actually decreased by changing the way reaction activation energy) to promote rapidly for some very slow chemical reaction.
In order to make better promote chemical reaction accelerator, good compatibility with resin, have lower melting point (80 ~ 120 ℃) of solid compounds, due to the extrusion can get good dispersity, can melt co-extrusion are joined when milling; And those poor compatibility, high melting point of solid, or other liquid compound, traditionally used so-called Masterbatch (Masterbatch) method, which put them into the molten carrier in advance, such as epoxy resin, poly resin vinegar) in molecular dispersion.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
Diethyl toluene diamine(DETDA) http://www.yaruichem.com
Decided to powder coating performance is the key to the matrix resin, to realize low temperature crosslinking of powder coatings, has now developed the unsaturated polyester, unsaturated acrylic resin, polyurethane acrylate resin, vinyl ether resin, etc. These new (Allnex) and DSM (DSM) have corresponding products.
Unsaturated resin is UV crosslinking or free radical thermal crosslinking powder coating the main film-forming material, is to determine the main components of the coatings properties and film performance.
To realize low temperature crosslinking, good storage stability, on the one hand, the resin can is required to give powder, powder shall be under the condition of 40 ℃ can be stored 3 ~ 6 months without agglomeration; On the other hand, the raw materials used shall be at low temperature (100 ℃ or less) under a low melt viscosity to ensure that the coating has good liquidity in the process of crosslinking.
This requires that the selected resin glass transition temperature (Tg) should be in 50 ~ 70 ℃ (at least in more than 40 ℃), average molecular weight of 1000 ~ 4000, and to narrow molecular weight distribution.
To get this resin is not easy, Tg above 50 ℃ resin melt is difficult to control, because C = C double bond at 80 ℃ can begin aggregation, and under 80 ℃, the viscosity is too high and difficult to handle. Commonly used method to reduce resin melt temperature is semicrystalline resin synthesis, join the crystalline compound, or amorphous oligomer.
Chinese name: Diethyl toluene diamine(DETDA)
Chinese alias: aryl, aryl diethyl - aryl - methyl-p-phenylenediamine
English name: Benzenediamine, ar, ar-diethyl-ar-methyl-English aliases:Diethyltoluenediamine; ar, ar-Diethyl-ar-methylbenzenediamine;Diethylmethylbenzenediamine;
CAS No. :68479-98-1
EINECS No. :270 -877-4
Molecular formula: C11H18N2
Molecular Weight: 178.28
Boiling point: 310 ℃
Refractive index: 1.581
Flash Point: > 140 ℃
Inchi: InChI = 1/C11H18N2/c1-4-8-6-7 (3) 10 (12) 11 (13) 9 (8) 5-2/h6H ,4-5,12-13H2 ,1-3H3 density : 1.022
Risk Codes: R10; R35
RIDADR: UN 3082
Safety instructions: S2; S26; S39; S61
Packing Group: III
Hazard Class: 6.1
By dendritic polymer structure design, synthesis and preparation of hyperbranched semicrystalline polymer cross-linked unsaturated resin at low temperature is also a kind of feasible method.
From the perspective of physical chemistry can be applied to consider the chemical reaction rate Arrhenius formula (Arrhenius), said k = Aexp - Ea/RT (exponential). As the rate constant, k R for molar gas constant, T for thermodynamic temperature, Ea as the apparent activation energy, A is refers to the former factor (also called frequency factor), is also commonly used another form: LNK = lnA - Ea/RT (log).
To improve the low temperature crosslinking reaction rate, can be analysis from its chemical reaction mechanism. It can be seen that the Ea for the apparent activation energy is a very important factor, activation energy is refers to the chemical reaction, the reactant molecules to reach the minimum energy required to activate molecular. Closely related to the size of the chemical reaction rate and activation energy, the lower the activation energy, the faster the reaction rate, thus reduces the activation energy will effectively promote the reaction.
Promoter by lowering the activation energy (which is actually decreased by changing the way reaction activation energy) to promote rapidly for some very slow chemical reaction.
In order to make better promote chemical reaction accelerator, good compatibility with resin, have lower melting point (80 ~ 120 ℃) of solid compounds, due to the extrusion can get good dispersity, can melt co-extrusion are joined when milling; And those poor compatibility, high melting point of solid, or other liquid compound, traditionally used so-called Masterbatch (Masterbatch) method, which put them into the molten carrier in advance, such as epoxy resin, poly resin vinegar) in molecular dispersion.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
Diethyl toluene diamine(DETDA) http://www.yaruichem.com
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Isopropylphenyl Phosphate(IPPP50)
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Tris(2-chloroisopropyl)Phosphate(TCPP)
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Triphenyl Phosphite (TPPI)
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Triphenyl Phosphate (TPP)
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Triethyl Phosphate (TEP)
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4-Chlorobenzoic acid (PBCA)
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Dimethyl thiotoluene diamine(DMTDA)
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Diethyl toluene diamine(DETDA)
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9-anthracene
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Trimethyl Phosphate (TMP)
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Isopropylphenyl Phosphate(IPPP65)
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Antioxidant Stabilizers|Defoamers|Penetrants
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Isopropylphenyl Phosphate(IPPP35)
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Tris(2-butoxyethyl)phosphate(TBEP)
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Trixylyl Phosphate(TXP)
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4,4'-Methylenebis(N-sec-butylaniline)-MDBA
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Diphenyl Isooctyl Phosphate-DPOP-S141
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Diphenyl Isodecyl Phosphate-DPDP-S148
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Cresyl Diphenyl Phosphate(CDP)
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Tris(1,3-Dichloro-2-Propyl)Phosphate
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Curing Agents|Chain Extenders|Crosslinking Agents
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2,2-Bis(Hydroxymethyl)Propionic Acid|DMPA
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Poly(1,4-Butanediol) Bis(4-Aminobenzoate)|P-1000
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3-Hydroxyethyloxyethyl-1-Hydroxyethylbenzenediene
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1,3-Bis(2-Hydroxyethoxy)Benzene|HER-Solid
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Chain Extender HQEE-Liquid
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Hydroquinone Bis(2-Hydroxyethyl)Ether|HQEE-Solid
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4,4'-Methylene-bis (3-chloro-2,6-diethylaniline)
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Alicyclic Amine Curing Agent Chain Extender HTDA
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Triallyl Isocyanurate|Crosslinker TAIC
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2,2-Bis(Hydroxymethyl)Butyric Acid|DMBA
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4,4'-Methylenebis(2-Ethylbenzenamine)|MOEA
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4,4'-Methylenebis(2,6-diethylaniline)|MDEA
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4,4'-Methylenebis(2-ethyl-6-methylaniline)|MMEA
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4,4'-Diaminodicyclohexyl Methane|PACM,HMDA
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Cycloaliphatic Curing Agent Chain Extender MACM
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3-Chloro-3'-Ethyl-4,4'-Diaminodiphenylmethane
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Flame Retardants|Plasticizers
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Isopropylphenyl Phosphate(IPPP95)
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Trihexyl Phosphate(THP)
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Triisobutyl Phosphate (TIBP)
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1-Phenyl-3-Methyl-5-Pyrazolone(PMP)
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Tris(2-chloroethyl)phosphate(TCEP)
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