News Details
Phosphorus compounds and silicon compounds compound flame retardants
2017-10-11 11:08:16
Phosphorus compounds and silicon compounds compound flame retardants
The application of phosphor compound and silicon compound compound flame retardant has been commercialized in foreign countries and the main SFR 100 resin and D C RM series silicon resin micropowder modifier have been commercialized.
Phosphine compound and silicon compound compound compound flame retardant SFR 100 and ammonium polyphosphate and pentaerythritol, the low additive amount can meet the requirements of polyolefin flame retardant and smoke suppression.
The application of phosphorus compounds and silicon compound compound flame retardants in epoxy resin were introduced. Fill the SFR 100, PP can improve the thermal stability of the temperature around 10 ℃, the bubble problem in order to overcome the melt processing.
Research shows that SFR 100 can improve the normal temperature and low temperature impact, processing, surface gloss and color of polymers. The best balance of flame retardancy, fluidity and mechanical properties can be achieved with 10% SFR 100 composite flame retardant. Wu et al. investigated the flame retardant properties of silicon epoxy resin complex.
With bisphenol A epoxy resin (BE188) or adjacent armour type phenolic epoxy resin (CNE200) respectively with diphenyl silicone glycol (DPSD) or triphenyl silanol (TPSO) response preparation of A new type of epoxy resin containing silicon, research of cured epoxy resin thermal stability and flame retardant properties, found that after introducing silicon groups, thermal properties and flame retardant performance of epoxy resin composites were improved.
The limit oxygen index (LOI) value of the cured epoxy resin was increased to 295% when the curing agent was cured by the phosphorous curing agent double (aminophenyl) phenoxyphosphine (BAPPO). The improvement of this flame retardant property is mainly attributed to the synergistic effect of Si/P. This new silicone epoxy resin is expected to be used in microelectronic packaging.
Diphenyl Isooctyl Phosphate(DPOP)Product Usage
Mainly Used In PC ﹑ PVC ﹑ PVA ﹑ EPOXY ﹑ Phenolic Resin ﹑ Acrylic Resin ﹑ Nitrile Resin Can Be Used As Plasticizers And Rubber Additives. Can Improve The ABS Resin Heat Resistance And Transparency, But Also Can Be Used As Heat Stabilizer.
Packing: 200 Kg / Iron, 1000Kg / IBC Barrel, 20 Tons / ISOTANK.
Diphenyl Isooctyl Phosphate (S141,362, DPOP) Product Overview
Chemical Classification: Diphenyl Isooctyl Phosphate, Diphenyl 2-Ethylhexyl Phosphate
Diphenyl Isooctyl Phosphate (S141,362, DPOP) Is An Excellent Flame Retardant Plasticizer That Can Be Used In Most Industrial Polymers Including PVC And Its Copolymers, Nitrocellulose, Ethylcellulose, Poly Methyl Cellulose Methyl Ester, Polystyrene And The Like. Diphenyl Isooctyl Phosphate (S141,362, DPOP) Are Generally Used In The Manufacture Of Vinyl Sheets, Coated Fabrics, Inks, Plastics, Rubber And Plastic Foamed Organic Sol, Adhesives, Vinyl And Conveyor Belts. Due To Excellent Solubility, Improve The Performance Of Many Formulations. In Addition, It Can Be The Final Product It Offers The Following Range Of Interesting Properties Such As Flame Retardancy, Low Temperature Flexibility, Abrasion Resistance, Grease Resistance, Excellent Light Stability And Outdoor Weather Resistance And Excellent High Screen Welding Performance. Due To Its Excellent Solubility, Diphenyl Isooctyl Phosphate (S141, 362, DPOP), And Then 3 Phr Of Bismuth Oxide And 10-20 Phr Of Aluminum Hydroxide Were Added.
Diphenyl Isooctyl Phosphate (S141,362, DPOP) Can Be Used As An Excellent Flame Retardant Material For Transparent Films. In Some Fire-Resistant Harsh Colored Films, It Is Recommended To Add Diphenyl Isooctyl Phosphate (S141,362, DPOP) To Significantly Improve The Light Stability And Outdoor Weather Resistance Of The Film.
(S141,362, DPOP) With Diphenyl Phosphate And Tricresyl Phosphate In The Presence Of 10-15% Of Phthalate Plasticizer Such As DOP, Phosphoric Acid Diphenyl Isooctyl Ester (S141, 362, DPOP) Allows The Resulting Plastic To Have A Low Initial Viscosity And A Good Good False Plasticity And Storage Stability. Due To Its Good Pseudoplasticity And Film-Forming Properties It Is Recommended To Add Diphenyl Isooctyl Phosphate (S141,362, DPOP) To PMMA-Based Plastics And Nitrocellulose Coatings And Inks.
Hsiue, the study found that using silicon-based reactive monomer three glycidyl phenyl epoxy silane (TGPS) and phosphorus curing agents of double oxygen (amino phenyl) phenyl phosphine preparation of epoxy resin, due to the introduction of silicon, the thermal stability of carbon layer is effectively improved, no longer occur when higher than 700 ℃ for carbon oxide layer and the phenomenon of weightlessness, 31 9% into carbon in the air, the LOI is crooked high to 36%.
Further base on both ends for ammonia propyl to replace polydimethylsiloxane (PDMS NH2) instead of TGPS BAPPO and the preparation of epoxy resin composite material, found that burns, phosphorus group first decomposition, and the remains of the rich phosphorus, material qualitative heat and insulating properties help to stop the degradation of polymer, to improve the thermal decomposition temperature of the polymer.
And decomposition of siloxane is heated to generate large amounts of silica due to the low surface energy, easy to migrate to the surface of the carbon layer, forming a continuous SiO2 layer, protect the rich phosphorus carbon layer will not be oxidative degradation, the synergistic effect of both greatly improve the flame retardant effect. When the content of phosphorus and silicon is 4.8% and 12.7% respectively, the LOI of epoxy resin can reach 45%.
Further research has been made to know that the LOI of epoxy resin is improved with the increase of silicon content. However, not all the increase of silicon content in the modified epoxy resin system can make its flame-retardant performance increase, studies have shown that: the commercialization of bisphenol A type epoxy resin with commercial MIBK ST (containing 30% ~ 31% mass fraction of size for 10 to 20 nm silica nanoparticles MIBK) (MIBK) solution blending, the preparation of silicon dioxide mass fraction was 10% ~ 70% of epoxy resin/silica nano hybrid material, further using phosphorus curing agents phosphite diethyl (DEP) for curing epoxy resin system, the study found that the LOI value of curing, but not obvious, namely nanoscale colloidal silica with phosphorus flame retardant effect is not obvious.
For nanometer silicon dioxide is shape rules of solid particles composed of loose layer, rather than the structure of the continuous dense hard silica network, so its barrier function can not completely.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
http://www.yaruichem.com
The application of phosphor compound and silicon compound compound flame retardant has been commercialized in foreign countries and the main SFR 100 resin and D C RM series silicon resin micropowder modifier have been commercialized.
Phosphine compound and silicon compound compound compound flame retardant SFR 100 and ammonium polyphosphate and pentaerythritol, the low additive amount can meet the requirements of polyolefin flame retardant and smoke suppression.
The application of phosphorus compounds and silicon compound compound flame retardants in epoxy resin were introduced. Fill the SFR 100, PP can improve the thermal stability of the temperature around 10 ℃, the bubble problem in order to overcome the melt processing.
Research shows that SFR 100 can improve the normal temperature and low temperature impact, processing, surface gloss and color of polymers. The best balance of flame retardancy, fluidity and mechanical properties can be achieved with 10% SFR 100 composite flame retardant. Wu et al. investigated the flame retardant properties of silicon epoxy resin complex.
With bisphenol A epoxy resin (BE188) or adjacent armour type phenolic epoxy resin (CNE200) respectively with diphenyl silicone glycol (DPSD) or triphenyl silanol (TPSO) response preparation of A new type of epoxy resin containing silicon, research of cured epoxy resin thermal stability and flame retardant properties, found that after introducing silicon groups, thermal properties and flame retardant performance of epoxy resin composites were improved.
The limit oxygen index (LOI) value of the cured epoxy resin was increased to 295% when the curing agent was cured by the phosphorous curing agent double (aminophenyl) phenoxyphosphine (BAPPO). The improvement of this flame retardant property is mainly attributed to the synergistic effect of Si/P. This new silicone epoxy resin is expected to be used in microelectronic packaging.
Diphenyl Isooctyl Phosphate(DPOP)Product Usage
Mainly Used In PC ﹑ PVC ﹑ PVA ﹑ EPOXY ﹑ Phenolic Resin ﹑ Acrylic Resin ﹑ Nitrile Resin Can Be Used As Plasticizers And Rubber Additives. Can Improve The ABS Resin Heat Resistance And Transparency, But Also Can Be Used As Heat Stabilizer.
Packing: 200 Kg / Iron, 1000Kg / IBC Barrel, 20 Tons / ISOTANK.
Diphenyl Isooctyl Phosphate (S141,362, DPOP) Product Overview
Chemical Classification: Diphenyl Isooctyl Phosphate, Diphenyl 2-Ethylhexyl Phosphate
Diphenyl Isooctyl Phosphate (S141,362, DPOP) Is An Excellent Flame Retardant Plasticizer That Can Be Used In Most Industrial Polymers Including PVC And Its Copolymers, Nitrocellulose, Ethylcellulose, Poly Methyl Cellulose Methyl Ester, Polystyrene And The Like. Diphenyl Isooctyl Phosphate (S141,362, DPOP) Are Generally Used In The Manufacture Of Vinyl Sheets, Coated Fabrics, Inks, Plastics, Rubber And Plastic Foamed Organic Sol, Adhesives, Vinyl And Conveyor Belts. Due To Excellent Solubility, Improve The Performance Of Many Formulations. In Addition, It Can Be The Final Product It Offers The Following Range Of Interesting Properties Such As Flame Retardancy, Low Temperature Flexibility, Abrasion Resistance, Grease Resistance, Excellent Light Stability And Outdoor Weather Resistance And Excellent High Screen Welding Performance. Due To Its Excellent Solubility, Diphenyl Isooctyl Phosphate (S141, 362, DPOP), And Then 3 Phr Of Bismuth Oxide And 10-20 Phr Of Aluminum Hydroxide Were Added.
Diphenyl Isooctyl Phosphate (S141,362, DPOP) Can Be Used As An Excellent Flame Retardant Material For Transparent Films. In Some Fire-Resistant Harsh Colored Films, It Is Recommended To Add Diphenyl Isooctyl Phosphate (S141,362, DPOP) To Significantly Improve The Light Stability And Outdoor Weather Resistance Of The Film.
(S141,362, DPOP) With Diphenyl Phosphate And Tricresyl Phosphate In The Presence Of 10-15% Of Phthalate Plasticizer Such As DOP, Phosphoric Acid Diphenyl Isooctyl Ester (S141, 362, DPOP) Allows The Resulting Plastic To Have A Low Initial Viscosity And A Good Good False Plasticity And Storage Stability. Due To Its Good Pseudoplasticity And Film-Forming Properties It Is Recommended To Add Diphenyl Isooctyl Phosphate (S141,362, DPOP) To PMMA-Based Plastics And Nitrocellulose Coatings And Inks.
Hsiue, the study found that using silicon-based reactive monomer three glycidyl phenyl epoxy silane (TGPS) and phosphorus curing agents of double oxygen (amino phenyl) phenyl phosphine preparation of epoxy resin, due to the introduction of silicon, the thermal stability of carbon layer is effectively improved, no longer occur when higher than 700 ℃ for carbon oxide layer and the phenomenon of weightlessness, 31 9% into carbon in the air, the LOI is crooked high to 36%.
Further base on both ends for ammonia propyl to replace polydimethylsiloxane (PDMS NH2) instead of TGPS BAPPO and the preparation of epoxy resin composite material, found that burns, phosphorus group first decomposition, and the remains of the rich phosphorus, material qualitative heat and insulating properties help to stop the degradation of polymer, to improve the thermal decomposition temperature of the polymer.
And decomposition of siloxane is heated to generate large amounts of silica due to the low surface energy, easy to migrate to the surface of the carbon layer, forming a continuous SiO2 layer, protect the rich phosphorus carbon layer will not be oxidative degradation, the synergistic effect of both greatly improve the flame retardant effect. When the content of phosphorus and silicon is 4.8% and 12.7% respectively, the LOI of epoxy resin can reach 45%.
Further research has been made to know that the LOI of epoxy resin is improved with the increase of silicon content. However, not all the increase of silicon content in the modified epoxy resin system can make its flame-retardant performance increase, studies have shown that: the commercialization of bisphenol A type epoxy resin with commercial MIBK ST (containing 30% ~ 31% mass fraction of size for 10 to 20 nm silica nanoparticles MIBK) (MIBK) solution blending, the preparation of silicon dioxide mass fraction was 10% ~ 70% of epoxy resin/silica nano hybrid material, further using phosphorus curing agents phosphite diethyl (DEP) for curing epoxy resin system, the study found that the LOI value of curing, but not obvious, namely nanoscale colloidal silica with phosphorus flame retardant effect is not obvious.
For nanometer silicon dioxide is shape rules of solid particles composed of loose layer, rather than the structure of the continuous dense hard silica network, so its barrier function can not completely.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
http://www.yaruichem.com
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