News Details
Microcapsules coating crosslinking agent
2017-3-17 11:24:03
Microcapsules coating crosslinking agent, microcapsule type latent epoxy resin agent intercourse is, in fact, using physical methods, the bi-component crosslinking agent at room temperature using fine droplets membrane package, formed microcapsules, join the epoxy resin will crosslinker crosslinked reactivity after temporarily closed up, and by heat, pressure condition such as the capsule rupture, releasing the crosslinking agent, so that the epoxy resin crosslinking.
Microcapsule type latent epoxy resin intercourse of film-former including cellulose, gelatin, polyvinyl alcohol, such as polyester, polysulfone, due to the strict preparation technology, the thickness of capsule membrane for storage, transportation and use will bring different degree of influence.
Microcapsule wall refers to a kind of polymer micro container or packaging. Microcapsule granulation technology is solid, liquid, or gas embedding, sealed in a tiny capsule becomes a kind of solid particles in the product technology.
: microcapsules with coating film or shell material coat tiny solid particles, liquid droplets or bubbles.
Microcapsule diameter: mm level to the micron level.
Micro capsule has certain permeability of globular utricle bubble, outer membrane, inner core into liquid. In recent years, the micro capsule technology is widely applied to microbe, plant and animal cells, enzymes and other immobilization of bioactive substances and chemical drugs. Commonly used the micro capsule of alginate/poly lysine micro capsule.
Because of the preparation technology is more complex, encystment process for a long time, biological activity of compounds with was encased has certain influence, and poly lysine price is quite expensive, which limit the use of the micro capsule. The basic material of the micro capsule preparation usually has the polyelectrolyte such as protein, fat and sugar.
Chitosan is partially remove degree of chitin, which has excellent toughness and inert, and hydrophilic, non-toxic, porous, uniform, chitin content in the nature at the same time is also very rich.
In view of this, from the particularity of this kind of natural polymer chitin functional group, as well as the advantages of non-toxic, hydrophilic, with strong alkali to take off the acetylation of chitosan, and then use the above method to achieve the spherical chitosan, and use the appropriate method to yeast embedding within spherical chitosan was prepared with better performance microcapsules, and discusses the conditions of chitosan into a ball, embedding the optimum conditions of yeast, and the feasibility of chitosan used as immobilized carrier.
Chinese name: Diethyl toluene diamine(DETDA)
Diethyltoluenediamine Raw material :
TDA industrial, Sichuan production
Ethylene (Et) polymer grade, Shanghai production
TEA industrial imports
A reagent grade additives
Under 10 ℃ and 92% relative humidity, phenolic amides competitive technology has faster than the formation of shaw D hardness. Solventless high reactivity of phenolic amide plus the hydrophobicity of CNSL derivatives, can ensure even in high humidity and low temperature conditions can also be appropriate crosslinking.
In addition, the rapid crosslinking and hardness is formed, leading to fast properties. In Cardolite laboratory tests found that when the epoxy coating based on phenolic amides in 5 ℃ and relative humidity of 85% of crosslinked under the condition of less than 24 hours, can be observed when polyurethane (pu) coating surface coating with good adhesion between the layers.
When using other phenolic amides found that the solvent-free products when exposed to uv light has good weather resistance. Figure 4 and 5 shows the carried out in accordance with the ASTM D4587 QUV -a exposure all system after the change of colour and lustre. In this study to evaluate all of the coating showed yellowing will happen over time, and using epoxy material same as expected.
However, in the use of two kinds of basic material of epoxy phenolic amide has the lowest Δ crosslinking agent of all E. At first glance, might think PolyA 1 # offers better colour than phenolic amides. But, as can be observed from falls in gloss, coating based on PolyA 1 # began pulverization after uv exposure, white powder and get lower delta E. Compared with the use of two kinds of basic material of epoxy formula, phenolic amides provides a more gentle and slow low gloss.
Corrosion protection with adhesion and resistance to salt fog (ASTM B117) to evaluate performance. Will use phenolic amides and PolyA 1 # 1 # configuration and finishing paint to dry film thickness of mil (DFT) spraying to sand blasting on the steel plate (SA) 2.5, crosslinking 7 days at room temperature after crosslinking exposed to 2000 h salt fog. Phenolic amides in the accelerated corrosion test system performance is superior to the PolyA 1 # system, found at the scene blister less blisters and scratches around damage reduced.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
Diethyl toluene diamine(DETDA) http://www.yaruichem.com
Microcapsule type latent epoxy resin intercourse of film-former including cellulose, gelatin, polyvinyl alcohol, such as polyester, polysulfone, due to the strict preparation technology, the thickness of capsule membrane for storage, transportation and use will bring different degree of influence.
Microcapsule wall refers to a kind of polymer micro container or packaging. Microcapsule granulation technology is solid, liquid, or gas embedding, sealed in a tiny capsule becomes a kind of solid particles in the product technology.
: microcapsules with coating film or shell material coat tiny solid particles, liquid droplets or bubbles.
Microcapsule diameter: mm level to the micron level.
Micro capsule has certain permeability of globular utricle bubble, outer membrane, inner core into liquid. In recent years, the micro capsule technology is widely applied to microbe, plant and animal cells, enzymes and other immobilization of bioactive substances and chemical drugs. Commonly used the micro capsule of alginate/poly lysine micro capsule.
Because of the preparation technology is more complex, encystment process for a long time, biological activity of compounds with was encased has certain influence, and poly lysine price is quite expensive, which limit the use of the micro capsule. The basic material of the micro capsule preparation usually has the polyelectrolyte such as protein, fat and sugar.
Chitosan is partially remove degree of chitin, which has excellent toughness and inert, and hydrophilic, non-toxic, porous, uniform, chitin content in the nature at the same time is also very rich.
In view of this, from the particularity of this kind of natural polymer chitin functional group, as well as the advantages of non-toxic, hydrophilic, with strong alkali to take off the acetylation of chitosan, and then use the above method to achieve the spherical chitosan, and use the appropriate method to yeast embedding within spherical chitosan was prepared with better performance microcapsules, and discusses the conditions of chitosan into a ball, embedding the optimum conditions of yeast, and the feasibility of chitosan used as immobilized carrier.
Chinese name: Diethyl toluene diamine(DETDA)
Diethyltoluenediamine Raw material :
TDA industrial, Sichuan production
Ethylene (Et) polymer grade, Shanghai production
TEA industrial imports
A reagent grade additives
Under 10 ℃ and 92% relative humidity, phenolic amides competitive technology has faster than the formation of shaw D hardness. Solventless high reactivity of phenolic amide plus the hydrophobicity of CNSL derivatives, can ensure even in high humidity and low temperature conditions can also be appropriate crosslinking.
In addition, the rapid crosslinking and hardness is formed, leading to fast properties. In Cardolite laboratory tests found that when the epoxy coating based on phenolic amides in 5 ℃ and relative humidity of 85% of crosslinked under the condition of less than 24 hours, can be observed when polyurethane (pu) coating surface coating with good adhesion between the layers.
When using other phenolic amides found that the solvent-free products when exposed to uv light has good weather resistance. Figure 4 and 5 shows the carried out in accordance with the ASTM D4587 QUV -a exposure all system after the change of colour and lustre. In this study to evaluate all of the coating showed yellowing will happen over time, and using epoxy material same as expected.
However, in the use of two kinds of basic material of epoxy phenolic amide has the lowest Δ crosslinking agent of all E. At first glance, might think PolyA 1 # offers better colour than phenolic amides. But, as can be observed from falls in gloss, coating based on PolyA 1 # began pulverization after uv exposure, white powder and get lower delta E. Compared with the use of two kinds of basic material of epoxy formula, phenolic amides provides a more gentle and slow low gloss.
Corrosion protection with adhesion and resistance to salt fog (ASTM B117) to evaluate performance. Will use phenolic amides and PolyA 1 # 1 # configuration and finishing paint to dry film thickness of mil (DFT) spraying to sand blasting on the steel plate (SA) 2.5, crosslinking 7 days at room temperature after crosslinking exposed to 2000 h salt fog. Phenolic amides in the accelerated corrosion test system performance is superior to the PolyA 1 # system, found at the scene blister less blisters and scratches around damage reduced.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
Diethyl toluene diamine(DETDA) http://www.yaruichem.com
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Isopropylphenyl Phosphate(IPPP50)
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Tris(2-chloroisopropyl)Phosphate(TCPP)
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Triphenyl Phosphite (TPPI)
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Triphenyl Phosphate (TPP)
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Triethyl Phosphate (TEP)
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4-Chlorobenzoic acid (PBCA)
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Dimethyl thiotoluene diamine(DMTDA)
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Diethyl toluene diamine(DETDA)
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9-anthracene
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Trimethyl Phosphate (TMP)
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Isopropylphenyl Phosphate(IPPP65)
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Antioxidant Stabilizers|Defoamers|Penetrants
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Isopropylphenyl Phosphate(IPPP35)
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Tris(2-butoxyethyl)phosphate(TBEP)
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Trixylyl Phosphate(TXP)
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4,4'-Methylenebis(N-sec-butylaniline)-MDBA
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Diphenyl Isooctyl Phosphate-DPOP-S141
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Diphenyl Isodecyl Phosphate-DPDP-S148
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Cresyl Diphenyl Phosphate(CDP)
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Tris(1,3-Dichloro-2-Propyl)Phosphate
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Curing Agents|Chain Extenders|Crosslinking Agents
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2,2-Bis(Hydroxymethyl)Propionic Acid|DMPA
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Poly(1,4-Butanediol) Bis(4-Aminobenzoate)|P-1000
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3-Hydroxyethyloxyethyl-1-Hydroxyethylbenzenediene
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1,3-Bis(2-Hydroxyethoxy)Benzene|HER-Solid
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Chain Extender HQEE-Liquid
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Hydroquinone Bis(2-Hydroxyethyl)Ether|HQEE-Solid
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4,4'-Methylene-bis (3-chloro-2,6-diethylaniline)
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Alicyclic Amine Curing Agent Chain Extender HTDA
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Triallyl Isocyanurate|Crosslinker TAIC
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2,2-Bis(Hydroxymethyl)Butyric Acid|DMBA
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4,4'-Methylenebis(2-Ethylbenzenamine)|MOEA
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4,4'-Methylenebis(2,6-diethylaniline)|MDEA
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4,4'-Methylenebis(2-ethyl-6-methylaniline)|MMEA
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4,4'-Diaminodicyclohexyl Methane|PACM,HMDA
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Cycloaliphatic Curing Agent Chain Extender MACM
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3-Chloro-3'-Ethyl-4,4'-Diaminodiphenylmethane
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Flame Retardants|Plasticizers
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Isopropylphenyl Phosphate(IPPP95)
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Trihexyl Phosphate(THP)
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Triisobutyl Phosphate (TIBP)
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1-Phenyl-3-Methyl-5-Pyrazolone(PMP)
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Tris(2-chloroethyl)phosphate(TCEP)
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- News List
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It ACTS as an auxiliary antiox -
The properties of phenolic ant -
Amine antioxidants -
Thermoplastic anti-oxygen agen -
Plastic auxiliary antioxidant -
Molecular structure of antioxi -
High polymer antioxidants -
General-purpose plastic antiox -
Phosphoric acid ester auxiliar -
Antioxidant compound products -
Polypropylene complex antioxid -
Compatibility of antioxidants -
Industrial plastic composite a -
An antioxidant for polymers -
PVC resin antioxidant