News Details
Imidazole/epoxy additive coating crosslinking agent
2017-8-19 11:04:49
Imidazole/epoxy additive coating crosslinking agent
The most representative products of imidazole/epoxy additive coatings are epi-cure P101. It is A reaction product of 2-methylmidazole and Epon828 liquid bisphenol A epoxy resin. It was first invented in 1973 in order to solve the dialysis problem caused by the use of imidazole in epoxy casting.
Imidazole/epoxide crosslinking agent has important status in the field of low temperature crosslinking epoxy powder. Imidazole/epoxy adduct crosslinking agent can be used as a low temperature crosslinking agent and can be used as crosslinking promoter and other crosslinking agent. The optimal low-temperature crosslinking performance can be provided under the baking conditions of 121/30min alone.
If combined with other non-catalytic amine crosslinking agents, it can not only reduce crosslinking temperature and improve crosslinking speed, but also improve the smoothness and anti-yellowing effect of the film. And phenols crosslinking agent and it can get a quick crosslinking (220 ℃ / 30 s) steel and pipeline anticorrosion functional powder.
The low temperature crosslinking epoxy powder prepared by imidazole/epoxide is also a problem of storage stability, which requires low temperature storage and transportation. It is reported that the polyisocyanate can be evenly coated on the imidazole/epoxy addition, which can improve the storage stability of the crosslinking agent without compromising its crosslinking performance.
Imidazole is used as the crosslinking agent for epoxy resin adhesive and is not used alone. The reference dosage is 4 ~ 8. Crosslinking conditions or 150 ℃ 70 ℃ / 8 h / 4 h. Crosslinked heat deformation temperature of 117 ~ 166 ℃. Imidazole react with copper sulfate to form a first wife complex, more stable at room temperature, in 90 ~ 110 ℃ when the decomposition reaction with epoxy group. At the same time, the metal ions can also be polymerized with the epoxy group and enter into the crosslinking to form a chelate. At a low temperature. With good storage stability, medium temperature can be crosslinked quickly. This kind of imidazole metal salt is used as the crosslinking agent promoter, dicyandiamide can lower the crosslinking temperature to 120 ℃.
Chinese name: Diethyl toluene diamine(DETDA)
Physical and chemical properties: light yellow transparent liquid, slightly soluble in water, soluble in alcohols, ethers, ketones and other polar organic solvents, and polyether, polyester polyol compatibility.
Density 1.022
Viscosity (20 ℃) ??mPa·ss290±10
Pour Point ℃-9
Boiling point of310°C
The most representative products of imidazole/epoxy additive coatings are epi-cure P101. It is A reaction product of 2-methylmidazole and Epon828 liquid bisphenol A epoxy resin. It was first invented in 1973 in order to solve the dialysis problem caused by the use of imidazole in epoxy casting.
Imidazole/epoxide crosslinking agent has important status in the field of low temperature crosslinking epoxy powder. Imidazole/epoxy adduct crosslinking agent can be used as a low temperature crosslinking agent and can be used as crosslinking promoter and other crosslinking agent. The optimal low-temperature crosslinking performance can be provided under the baking conditions of 121/30min alone.
If combined with other non-catalytic amine crosslinking agents, it can not only reduce crosslinking temperature and improve crosslinking speed, but also improve the smoothness and anti-yellowing effect of the film. And phenols crosslinking agent and it can get a quick crosslinking (220 ℃ / 30 s) steel and pipeline anticorrosion functional powder.
The low temperature crosslinking epoxy powder prepared by imidazole/epoxide is also a problem of storage stability, which requires low temperature storage and transportation. It is reported that the polyisocyanate can be evenly coated on the imidazole/epoxy addition, which can improve the storage stability of the crosslinking agent without compromising its crosslinking performance.
Imidazole is used as the crosslinking agent for epoxy resin adhesive and is not used alone. The reference dosage is 4 ~ 8. Crosslinking conditions or 150 ℃ 70 ℃ / 8 h / 4 h. Crosslinked heat deformation temperature of 117 ~ 166 ℃. Imidazole react with copper sulfate to form a first wife complex, more stable at room temperature, in 90 ~ 110 ℃ when the decomposition reaction with epoxy group. At the same time, the metal ions can also be polymerized with the epoxy group and enter into the crosslinking to form a chelate. At a low temperature. With good storage stability, medium temperature can be crosslinked quickly. This kind of imidazole metal salt is used as the crosslinking agent promoter, dicyandiamide can lower the crosslinking temperature to 120 ℃.
Chinese name: Diethyl toluene diamine(DETDA)
Physical and chemical properties: light yellow transparent liquid, slightly soluble in water, soluble in alcohols, ethers, ketones and other polar organic solvents, and polyether, polyester polyol compatibility.
Density 1.022
Viscosity (20 ℃) ??mPa·ss290±10
Pour Point ℃-9
Boiling point of310°C
Flash Point°C161.1°C
Epoxy is a resin compound that contains at least two reactive epoxies in the molecules. Epoxy resin by crosslinking have many prominent excellent performance, such as for a variety of materials, especially for the adhesion of the metal is very strong, has a strong resistance to chemical corrosion resistance, high mechanical strength, good electrical insulation, corrosion resistance, etc.
The epoxy resin can be cross-linked in a wide range of temperature, and the volume is reduced when cross-linking. Bisphenol A epoxy resin is A polymer compound made of bisphenol A and epichlorohydrin under alkaline conditions. Manufactured goods for epoxy resin has good physical and mechanical properties, chemical resistance, electrical insulation properties, is widely used in coating, adhesive, glass fiber reinforced plastic, laminate, electronic casting and potting and coating etc.
In powder coating melt flow horizontally spreading stage, the whole system into molten powder coating at this time to join the flow ping agent has migrated to the molten coating to the surface of the powder internally so it between resin and filler pigment wetting effect is not obvious, so you need to join another high softening point, not easy to quickly migrate to the surface of acrylate polymers to reduce molten coating inside and substrate, the surface tension between fillers, thus promotes molten system spreading of substrate and infiltration of fillers. This agent is a brightener (also known as a brightener, a wetting promoter).
As temperatures rise, in the process, powder coating viscosity sharply reduced, the flow and infiltrating force than is produced by the viscosity of block, so the process is infiltrating and flow flat major phases. Because of the whitening agent and flow ping agent work together, to reduce the surface tension of the molten coating inside, so the resin to infiltrate fillers, and accelerates the moisture of the molten fluid within volatile substances such as overflow from the surface (join benzoin overflow) can accelerate the bubble burst, overflow the bubble will be under the influence of surface tension, into a smooth surface.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
Epoxy is a resin compound that contains at least two reactive epoxies in the molecules. Epoxy resin by crosslinking have many prominent excellent performance, such as for a variety of materials, especially for the adhesion of the metal is very strong, has a strong resistance to chemical corrosion resistance, high mechanical strength, good electrical insulation, corrosion resistance, etc.
The epoxy resin can be cross-linked in a wide range of temperature, and the volume is reduced when cross-linking. Bisphenol A epoxy resin is A polymer compound made of bisphenol A and epichlorohydrin under alkaline conditions. Manufactured goods for epoxy resin has good physical and mechanical properties, chemical resistance, electrical insulation properties, is widely used in coating, adhesive, glass fiber reinforced plastic, laminate, electronic casting and potting and coating etc.
In powder coating melt flow horizontally spreading stage, the whole system into molten powder coating at this time to join the flow ping agent has migrated to the molten coating to the surface of the powder internally so it between resin and filler pigment wetting effect is not obvious, so you need to join another high softening point, not easy to quickly migrate to the surface of acrylate polymers to reduce molten coating inside and substrate, the surface tension between fillers, thus promotes molten system spreading of substrate and infiltration of fillers. This agent is a brightener (also known as a brightener, a wetting promoter).
As temperatures rise, in the process, powder coating viscosity sharply reduced, the flow and infiltrating force than is produced by the viscosity of block, so the process is infiltrating and flow flat major phases. Because of the whitening agent and flow ping agent work together, to reduce the surface tension of the molten coating inside, so the resin to infiltrate fillers, and accelerates the moisture of the molten fluid within volatile substances such as overflow from the surface (join benzoin overflow) can accelerate the bubble burst, overflow the bubble will be under the influence of surface tension, into a smooth surface.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
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Isopropylphenyl Phosphate(IPPP50)
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Tris(2-chloroisopropyl)Phosphate(TCPP)
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Triphenyl Phosphite (TPPI)
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Triphenyl Phosphate (TPP)
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Triethyl Phosphate (TEP)
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4-Chlorobenzoic acid (PBCA)
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Dimethyl thiotoluene diamine(DMTDA)
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Diethyl toluene diamine(DETDA)
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9-anthracene
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Trimethyl Phosphate (TMP)
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Isopropylphenyl Phosphate(IPPP65)
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Antioxidant Stabilizers|Defoamers|Penetrants
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Isopropylphenyl Phosphate(IPPP35)
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Tris(2-butoxyethyl)phosphate(TBEP)
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Trixylyl Phosphate(TXP)
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4,4'-Methylenebis(N-sec-butylaniline)-MDBA
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Diphenyl Isooctyl Phosphate-DPOP-S141
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Diphenyl Isodecyl Phosphate-DPDP-S148
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Cresyl Diphenyl Phosphate(CDP)
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Tris(1,3-Dichloro-2-Propyl)Phosphate
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Curing Agents|Chain Extenders|Crosslinking Agents
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2,2-Bis(Hydroxymethyl)Propionic Acid|DMPA
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Poly(1,4-Butanediol) Bis(4-Aminobenzoate)|P-1000
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3-Hydroxyethyloxyethyl-1-Hydroxyethylbenzenediene
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1,3-Bis(2-Hydroxyethoxy)Benzene|HER-Solid
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Chain Extender HQEE-Liquid
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Hydroquinone Bis(2-Hydroxyethyl)Ether|HQEE-Solid
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4,4'-Methylene-bis (3-chloro-2,6-diethylaniline)
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Alicyclic Amine Curing Agent Chain Extender HTDA
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Triallyl Isocyanurate|Crosslinker TAIC
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2,2-Bis(Hydroxymethyl)Butyric Acid|DMBA
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4,4'-Methylenebis(2-Ethylbenzenamine)|MOEA
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4,4'-Methylenebis(2,6-diethylaniline)|MDEA
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4,4'-Methylenebis(2-ethyl-6-methylaniline)|MMEA
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4,4'-Diaminodicyclohexyl Methane|PACM,HMDA
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Cycloaliphatic Curing Agent Chain Extender MACM
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3-Chloro-3'-Ethyl-4,4'-Diaminodiphenylmethane
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Flame Retardants|Plasticizers
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Isopropylphenyl Phosphate(IPPP95)
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Trihexyl Phosphate(THP)
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Triisobutyl Phosphate (TIBP)
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1-Phenyl-3-Methyl-5-Pyrazolone(PMP)
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Tris(2-chloroethyl)phosphate(TCEP)
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- News List
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The properties of phenolic ant -
Amine antioxidants -
Thermoplastic anti-oxygen agen -
Plastic auxiliary antioxidant -
Molecular structure of antioxi -
High polymer antioxidants -
General-purpose plastic antiox -
Phosphoric acid ester auxiliar -
Antioxidant compound products -
Polypropylene complex antioxid -
Compatibility of antioxidants -
Industrial plastic composite a -
An antioxidant for polymers -
PVC resin antioxidant