News Details
Flame retardant modified phenolic resin
2017-10-31 11:39:16
Flame retardant modified phenolic resin
The latest research shows that the modified phenolic resin formed by introducing DOPO into phenolic resin is suitable for use as flame retardant curing agent. Shieh et al first DOPO (I) reacts with formaldehyde, and then PN, MPN synthesized 2 derivatives: ODOPM-PN (VII) and (VIII) ODOPM-MPN.
Containing modified phenolic resin flame retardant type Tg/ C N2 Td/, weight loss of 10% DEG N2700 DEG, carbon /% average burning time /s smoke UL-94PN1754373489 trace V-0 VII 161407430 no V-0 VII /PN165411410 no V-0 VIII 195387370 no V-0 VIII /PN178427390 without V-0.
Epoxy resin curing DOPO derivatives than epoxy resin curing Td PN decreased, but Tg changed little, and the char yield increased almost smokeless release, flame retardant epoxy resin were improved significantly, 4 kinds of DOPO derivatives curing, can reach the V-0 level by UL-94 test.
Another kind of phenolic resin modified by DOPO IX (I) and 4- hydroxy benzaldehyde by addition and polycondensation reaction. Because the product chain contains polyphenol groups, it can be used as curing agent for cresol novolac epoxy resin (CNE) resin. IX by CNE resin after curing, high Tg (>160 C), good thermal stability (less than 300 degrees without weight loss). When the phosphorus content is 2%, the oxygen index of the cured CNE resin is 26, and the UL-94 test reaches V-0 grade.
There are reports of 2 kinds of modified phenolic resin: X and Xi, they can also be used as a curing agent of CNE resin. The product exhibited good thermal stability (>320 C), high Tg (159~178 C), high char yield (N2, 70 C, >50%) and LOI (26 ~ 32.5). X can also be mixed with MPN as the curing agent of CNE resin, and the resin is improved because of the synergistic effect of P-N. (160~186) and LOI (28 - 33.5).
The modified phenolic resin compared to the derivatives of DOPO III, the performance is similar, but because of the modified phenolic resin and polymer compatibility better, relatively simple process and low cost, so it can be better popularization and application, they can all be used as curing agent of epoxy resin and semiconductor packaging laminated materials in electronics.
DOPO derivatives as modified phenolic resin flame retardant agent and curing agent into epoxy resin, improve the flame retardancy and thermal stability of epoxy resin, more importantly, to avoid the brominated epoxy resin in use and recycling on the environment caused by pollution in the process, has opened up a new path for the development of epoxy resin.
In the future development and application of DOPO derivatives also need to solve 2 problems, one is the synthesis of manpower DOPO, simplify the process, reduce the cost, to ultimately reduce the cost of DOPO derivatives and more favorable to participate in market competition to lay a good foundation; the two is the need to synergistic effect on DOP0 derivatives of phosphorus, nitrogen and other non halogen elements to strengthen the research, expand the types of DOPO derivatives and their applications.
Tris (1,3-Dichloro-2-Propyl) Phosphate (Flame Retardant TDCPP)
CAS No.:13674-87-8
HS: 29199000
Tax Rate (%): 9%
Tris (1,3-Dichloro-2-Propyl) Phosphate (TDCPP) Raw Materials: Phosphorus Oxychloride, Epichlorohydrin
Tris (1,3-Dichloro-2-Propyl) Phosphate (Flame Retardant TDCPP) Use:
The Product Has A High Efficiency Flame Retardant, Low Volatility, High Thermal Stability, Water Resistance, Alkali Stable And Soluble In Most Organic Substances, Processing Performance, With Plastic, Moisture, Anti-Static, Anti-Pull, Anti-Compression Performance. Widely Used In Unsaturated Polyester, Polyurethane Foam, Epoxy Resin, Phenolic Resin, Rubber, Soft Polyvinyl Chloride, Synthetic Fibers And Other Plastics And Coatings At High Temperature Pyrolysis, Can Be Used As Emulsifier And Explosion-Proof Agent.
At present, the thermal insulation materials commonly used in the heat preservation market are molded polystyrene board, extruded polystyrene board, polyurethane foam and so on. The biggest problem is that these insulation materials, poor fire performance of them, and a lot of toxic smoke, even if the large amount of flame retardant, because the boiling point of general modified phenolic resin flame retardant is 300 DEG C, when the fire occurs, the ambient temperature can reach 1000 DEG C, flame retardant performance is still volatile, so fire not ideal.
Due to the use of external insulation materials commonly used external thermal insulation system is mostly flammable, the congenital form security risks, once encountered fire, these materials even become "accelerator" and "bomb", boosting the spread of fire, and the fire loss increased difficulty. The flammability of these insulation materials also brings great inconvenience to the rescue work of construction and fire.
Modified phenolic board is a new type of flame retardant, low smoke and fire insulation materials, its most prominent feature is the flame retardant, low smoke and high temperature variation, has the characteristics of light weight, heat insulation, good heat resistance, good dimensional stability, and it has a similar expansion coefficient and aluminum refractory material, which belongs to (fire B), low smoke, no melting, no dripping.
In Europe and the United States and other external wall insulation technology in advanced countries, the phenolic building panels of the fire performance is particularly valued, and vigorously promote the use of. For example, the United States currently uses sound insulation and fire retardant foam plastics 40% phenolic materials, Japan promulgated the "phenolic foam as standard building combustible materials" decree, the building wall using a large number of phenolic foam.
Not only pay attention to the fire resistance of thermal insulation material, but also pay more attention to the fire resistance of the whole insulation system. On the basis of modified phenolic board as insulation layer, an integrated system of phenolic fire prevention and insulation board with fire prevention, heat preservation and decoration was developed again".
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
http://www.yaruichem.com
The latest research shows that the modified phenolic resin formed by introducing DOPO into phenolic resin is suitable for use as flame retardant curing agent. Shieh et al first DOPO (I) reacts with formaldehyde, and then PN, MPN synthesized 2 derivatives: ODOPM-PN (VII) and (VIII) ODOPM-MPN.
Containing modified phenolic resin flame retardant type Tg/ C N2 Td/, weight loss of 10% DEG N2700 DEG, carbon /% average burning time /s smoke UL-94PN1754373489 trace V-0 VII 161407430 no V-0 VII /PN165411410 no V-0 VIII 195387370 no V-0 VIII /PN178427390 without V-0.
Epoxy resin curing DOPO derivatives than epoxy resin curing Td PN decreased, but Tg changed little, and the char yield increased almost smokeless release, flame retardant epoxy resin were improved significantly, 4 kinds of DOPO derivatives curing, can reach the V-0 level by UL-94 test.
Another kind of phenolic resin modified by DOPO IX (I) and 4- hydroxy benzaldehyde by addition and polycondensation reaction. Because the product chain contains polyphenol groups, it can be used as curing agent for cresol novolac epoxy resin (CNE) resin. IX by CNE resin after curing, high Tg (>160 C), good thermal stability (less than 300 degrees without weight loss). When the phosphorus content is 2%, the oxygen index of the cured CNE resin is 26, and the UL-94 test reaches V-0 grade.
There are reports of 2 kinds of modified phenolic resin: X and Xi, they can also be used as a curing agent of CNE resin. The product exhibited good thermal stability (>320 C), high Tg (159~178 C), high char yield (N2, 70 C, >50%) and LOI (26 ~ 32.5). X can also be mixed with MPN as the curing agent of CNE resin, and the resin is improved because of the synergistic effect of P-N. (160~186) and LOI (28 - 33.5).
The modified phenolic resin compared to the derivatives of DOPO III, the performance is similar, but because of the modified phenolic resin and polymer compatibility better, relatively simple process and low cost, so it can be better popularization and application, they can all be used as curing agent of epoxy resin and semiconductor packaging laminated materials in electronics.
DOPO derivatives as modified phenolic resin flame retardant agent and curing agent into epoxy resin, improve the flame retardancy and thermal stability of epoxy resin, more importantly, to avoid the brominated epoxy resin in use and recycling on the environment caused by pollution in the process, has opened up a new path for the development of epoxy resin.
In the future development and application of DOPO derivatives also need to solve 2 problems, one is the synthesis of manpower DOPO, simplify the process, reduce the cost, to ultimately reduce the cost of DOPO derivatives and more favorable to participate in market competition to lay a good foundation; the two is the need to synergistic effect on DOP0 derivatives of phosphorus, nitrogen and other non halogen elements to strengthen the research, expand the types of DOPO derivatives and their applications.
Tris (1,3-Dichloro-2-Propyl) Phosphate (Flame Retardant TDCPP)
CAS No.:13674-87-8
HS: 29199000
Tax Rate (%): 9%
Tris (1,3-Dichloro-2-Propyl) Phosphate (TDCPP) Raw Materials: Phosphorus Oxychloride, Epichlorohydrin
Tris (1,3-Dichloro-2-Propyl) Phosphate (Flame Retardant TDCPP) Use:
The Product Has A High Efficiency Flame Retardant, Low Volatility, High Thermal Stability, Water Resistance, Alkali Stable And Soluble In Most Organic Substances, Processing Performance, With Plastic, Moisture, Anti-Static, Anti-Pull, Anti-Compression Performance. Widely Used In Unsaturated Polyester, Polyurethane Foam, Epoxy Resin, Phenolic Resin, Rubber, Soft Polyvinyl Chloride, Synthetic Fibers And Other Plastics And Coatings At High Temperature Pyrolysis, Can Be Used As Emulsifier And Explosion-Proof Agent.
At present, the thermal insulation materials commonly used in the heat preservation market are molded polystyrene board, extruded polystyrene board, polyurethane foam and so on. The biggest problem is that these insulation materials, poor fire performance of them, and a lot of toxic smoke, even if the large amount of flame retardant, because the boiling point of general modified phenolic resin flame retardant is 300 DEG C, when the fire occurs, the ambient temperature can reach 1000 DEG C, flame retardant performance is still volatile, so fire not ideal.
Due to the use of external insulation materials commonly used external thermal insulation system is mostly flammable, the congenital form security risks, once encountered fire, these materials even become "accelerator" and "bomb", boosting the spread of fire, and the fire loss increased difficulty. The flammability of these insulation materials also brings great inconvenience to the rescue work of construction and fire.
Modified phenolic board is a new type of flame retardant, low smoke and fire insulation materials, its most prominent feature is the flame retardant, low smoke and high temperature variation, has the characteristics of light weight, heat insulation, good heat resistance, good dimensional stability, and it has a similar expansion coefficient and aluminum refractory material, which belongs to (fire B), low smoke, no melting, no dripping.
In Europe and the United States and other external wall insulation technology in advanced countries, the phenolic building panels of the fire performance is particularly valued, and vigorously promote the use of. For example, the United States currently uses sound insulation and fire retardant foam plastics 40% phenolic materials, Japan promulgated the "phenolic foam as standard building combustible materials" decree, the building wall using a large number of phenolic foam.
Not only pay attention to the fire resistance of thermal insulation material, but also pay more attention to the fire resistance of the whole insulation system. On the basis of modified phenolic board as insulation layer, an integrated system of phenolic fire prevention and insulation board with fire prevention, heat preservation and decoration was developed again".
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
http://www.yaruichem.com
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