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Epoxy resin flame retardant containing curing action
2017-11-9 12:40:59
Epoxy resin flame retardant containing curing action
Epoxy resin flame retardant with curing effect is an important aspect of structural flame retardant epoxy resin. Epoxy resin cured by curing epoxy resin flame retardant has excellent flame retardancy and no appearance.
At present, the cured epoxy resin flame retardants mainly contain bromine chlorine curing flame retardant, phosphorus curing flame retardant, nitrogen containing curing flame retardant and silicon containing curing flame retardant 4 kinds. The brominated flame retardant curing of the earliest and most sophisticated technology, which is widely used for its low cost, good flame retardant effect, but also will produce toxic gases during combustion, being non halogenated flame retardant instead of curing.
Because the cured epoxy resin contains a large amount of hydroxyl groups, and phosphorus compounds are easy to react with hydroxyl groups, phosphorus containing flame retardant is an efficient flame retardant for epoxy resin.
Toldy with three P2O5, phenol and melamine synthesized a containing organic phosphorus substance: the generation of three phenol (MPP), the two generation of three phenol (DPP) and the three generation of three phenol (TPP), and use them as curing agent EP, and to study the thermal performance of the system. The results showed that when the phosphorus content was 2.5%, the LOI value of the system reached 28%, and the flame retardancy reached UL94 V-0 grade.
Two phenolic epoxy curing agents DOPO-FP and DOPO-FMP were prepared by the reaction of C, S, Wang and DOPO with formaldehyde, and then reacted with phenol formaldehyde resin, melamine and phenol respectively. The results showed that the carbon content of the cured resins at 700 degrees >30% was two. The DOPO-FP cured resin reached UL94 V-0 grade when the phosphorus content was 1.45%, and the DOPO-FMP cured resin reached UL94 V-0 grade with phosphorus and nitrogen mass fractions of 0.81% and 2.36%, respectively.
A new type of curing agent BAMPO was synthesized by Sergei V Lechik (two amino phenyl methyl phosphonate), used for curing epoxy resin DGEBA (bisphenol A glycidyl ester, two) can be used in the production of epoxy resin / glass fiber laminate. Compared with DDS cured epoxy resin, the mechanical properties of the epoxy resin prepared by BAMPO curing are equivalent, but the flame retardancy of the epoxy resin is greatly improved.
A novel phosphorus containing phenolic resin (DOPO-PN) was prepared by the reaction of Ying Ling Liu with DOPO and 4- hydroxy benzoic acid, which was used as the curing agent of epoxy resin and the thermal properties of the cured system were studied. The results show that when the phosphorus content is 2%, the LOI of the cured product is 26%, reaching UL94 V0 grade. The curing system also has high thermal stability, and its Tg is up to 160.
Tris(2-chloroisopropyl)Phosphate(TCPP)
The product is used for the soft / hard polyurethane foam, with thermal and hydrolytic stability good, especially suitable for ASTME84 (Level 11) foam, with low viscosity unsaturated polyester resin in low temperature application and phenolic plastics at. This product is also used to grab the foam sealant and sheet production. For polyvinyl chloride, polystyrene, phenolic resin, acrylic resin and rubber, coating, flame retardant, also used for soft and hard polyurethane foam, epoxy resin, polystyrene, cellulose acetate, ethyl cellulose tree and phenolic plastics, polyvinyl acetate and gun type foam sealant production. Particularly recommended for rigid polyurethane foam has excellent thermal and hydrolytic stability is particularly suitable for ASTM84 (II), compound for polyurethane foam and unsaturated resin and phenolic plastics.
Due to the transport process to avoid collision damage, Tris2-chloropropyl phosphate TCPP packaging methods generally used 250KG galvanized iron drum.
Below to introduce some of Tris2-chloropropyl phosphate TCPP packaging:
Net weight 250KG/ galvanized iron drum (a small cabinet pallet loaded 20 tons), 1000KG/IB barrels (a small cabinet loaded 18 tons or 23 tons of ISOTANK).
Company 1.5 hour drive from Shanghai, the general sent to Shanghai port, the goods from customs inspection to the fastest one week after, the slowest ten days.
In view of the domestic and foreign demand is relatively small clients, also can use 50KG plastic bucket.
If you have special requirements on the Tris2-chloropropyl phosphate TCPP packaging, please contact us, try to meet the packaging requirements of customers.
Wei Zhenjie (by 2,3- epoxypropoxy) p-contained silicone hybrids prepared by propyl trimethoxy silane reaction with phosphoric acid, and added to the bisphenol A epoxy resin /4,4- two amino two phenyl methane / epoxy resin system containing silicone hybrid curing material preparation.
The study shows that the curing system of Tg is better than that of pure epoxy resin curing system, the initial decomposition temperature lower than pure epoxy resin, high temperature and carbon residue rate is greatly improved; when the phosphorus containing silicone hybrid materials was 30 phr, the curing system of Tg increased by 9 DEG C, the limiting oxygen index reached 27.3%, 700 C residues the carbon yield reached 34.1%, increased by 28% and 77.8% respectively compared with pure epoxy resin.
People into groups in the backbone of epoxy resin flame retardant (halogen element except), thus becoming the essence of flame retardant epoxy resin. The essence of durable flame retardant epoxy resin flame retardant efficiency, there is no additive type flame retardant has a volatile, leaching and migration, but also can realize the synergistic effects in the molecule, is environmentally friendly flame retardant polymer materials. But the cost of production is high and the manufacturing process is complex, which limits their application, and can only be used for those places which do not pay much attention to economic factors.
Phosphorus containing flame retardant epoxy resin phosphoric ester epoxy resin is an important organic phosphorus series of halogen-free flame retardant epoxy resin, the main chain is connected with epoxy compounds containing phosphoric acid ester and compared to pure resin showed excellent flame retardant performance.
Gao first 2,2- two methyl -1,3- propylene glycol, 1,2- dichloromethane and phosphorus trichloride 5,5- two methyl -2- oxidation -1,3,2- two oxygen phosphorus heterocyclic hexane compounds were synthesized by 4- (DODP), the synthesis of DODP, 1,2- and p- were benzoquinone (5,5- two -2- -1,3,2- two oxygen oxidation of methyl -4- has phosphorusheterocycle oxy) - phenol (DODPP), and finally through the DODPP and EP synthesis of phosphorous EP. Pure bisphenol A type EP (DGEBA) and EP with different phosphorus content were cured by low molecular weight polyimide (PI).
The cured EP system through the TGA test showed that the phosphorus EP system has good thermal stability; when w (P) =2.5% system, carbon residue at 1000 DEG C rate was 46%, while the pure EP at 900 DEG C is only 7%; the LOI (oxygen index) reached 30.2%, and the latter only 19.8%. Therefore, the curing system has good thermal stability and flame retardancy. At the same time, the low molecular weight PI endows the system with higher toughness and impact strength.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
http://www.yaruichem.com
Epoxy resin flame retardant with curing effect is an important aspect of structural flame retardant epoxy resin. Epoxy resin cured by curing epoxy resin flame retardant has excellent flame retardancy and no appearance.
At present, the cured epoxy resin flame retardants mainly contain bromine chlorine curing flame retardant, phosphorus curing flame retardant, nitrogen containing curing flame retardant and silicon containing curing flame retardant 4 kinds. The brominated flame retardant curing of the earliest and most sophisticated technology, which is widely used for its low cost, good flame retardant effect, but also will produce toxic gases during combustion, being non halogenated flame retardant instead of curing.
Because the cured epoxy resin contains a large amount of hydroxyl groups, and phosphorus compounds are easy to react with hydroxyl groups, phosphorus containing flame retardant is an efficient flame retardant for epoxy resin.
Toldy with three P2O5, phenol and melamine synthesized a containing organic phosphorus substance: the generation of three phenol (MPP), the two generation of three phenol (DPP) and the three generation of three phenol (TPP), and use them as curing agent EP, and to study the thermal performance of the system. The results showed that when the phosphorus content was 2.5%, the LOI value of the system reached 28%, and the flame retardancy reached UL94 V-0 grade.
Two phenolic epoxy curing agents DOPO-FP and DOPO-FMP were prepared by the reaction of C, S, Wang and DOPO with formaldehyde, and then reacted with phenol formaldehyde resin, melamine and phenol respectively. The results showed that the carbon content of the cured resins at 700 degrees >30% was two. The DOPO-FP cured resin reached UL94 V-0 grade when the phosphorus content was 1.45%, and the DOPO-FMP cured resin reached UL94 V-0 grade with phosphorus and nitrogen mass fractions of 0.81% and 2.36%, respectively.
A new type of curing agent BAMPO was synthesized by Sergei V Lechik (two amino phenyl methyl phosphonate), used for curing epoxy resin DGEBA (bisphenol A glycidyl ester, two) can be used in the production of epoxy resin / glass fiber laminate. Compared with DDS cured epoxy resin, the mechanical properties of the epoxy resin prepared by BAMPO curing are equivalent, but the flame retardancy of the epoxy resin is greatly improved.
A novel phosphorus containing phenolic resin (DOPO-PN) was prepared by the reaction of Ying Ling Liu with DOPO and 4- hydroxy benzoic acid, which was used as the curing agent of epoxy resin and the thermal properties of the cured system were studied. The results show that when the phosphorus content is 2%, the LOI of the cured product is 26%, reaching UL94 V0 grade. The curing system also has high thermal stability, and its Tg is up to 160.
Tris(2-chloroisopropyl)Phosphate(TCPP)
The product is used for the soft / hard polyurethane foam, with thermal and hydrolytic stability good, especially suitable for ASTME84 (Level 11) foam, with low viscosity unsaturated polyester resin in low temperature application and phenolic plastics at. This product is also used to grab the foam sealant and sheet production. For polyvinyl chloride, polystyrene, phenolic resin, acrylic resin and rubber, coating, flame retardant, also used for soft and hard polyurethane foam, epoxy resin, polystyrene, cellulose acetate, ethyl cellulose tree and phenolic plastics, polyvinyl acetate and gun type foam sealant production. Particularly recommended for rigid polyurethane foam has excellent thermal and hydrolytic stability is particularly suitable for ASTM84 (II), compound for polyurethane foam and unsaturated resin and phenolic plastics.
Due to the transport process to avoid collision damage, Tris2-chloropropyl phosphate TCPP packaging methods generally used 250KG galvanized iron drum.
Below to introduce some of Tris2-chloropropyl phosphate TCPP packaging:
Net weight 250KG/ galvanized iron drum (a small cabinet pallet loaded 20 tons), 1000KG/IB barrels (a small cabinet loaded 18 tons or 23 tons of ISOTANK).
Company 1.5 hour drive from Shanghai, the general sent to Shanghai port, the goods from customs inspection to the fastest one week after, the slowest ten days.
In view of the domestic and foreign demand is relatively small clients, also can use 50KG plastic bucket.
If you have special requirements on the Tris2-chloropropyl phosphate TCPP packaging, please contact us, try to meet the packaging requirements of customers.
Wei Zhenjie (by 2,3- epoxypropoxy) p-contained silicone hybrids prepared by propyl trimethoxy silane reaction with phosphoric acid, and added to the bisphenol A epoxy resin /4,4- two amino two phenyl methane / epoxy resin system containing silicone hybrid curing material preparation.
The study shows that the curing system of Tg is better than that of pure epoxy resin curing system, the initial decomposition temperature lower than pure epoxy resin, high temperature and carbon residue rate is greatly improved; when the phosphorus containing silicone hybrid materials was 30 phr, the curing system of Tg increased by 9 DEG C, the limiting oxygen index reached 27.3%, 700 C residues the carbon yield reached 34.1%, increased by 28% and 77.8% respectively compared with pure epoxy resin.
People into groups in the backbone of epoxy resin flame retardant (halogen element except), thus becoming the essence of flame retardant epoxy resin. The essence of durable flame retardant epoxy resin flame retardant efficiency, there is no additive type flame retardant has a volatile, leaching and migration, but also can realize the synergistic effects in the molecule, is environmentally friendly flame retardant polymer materials. But the cost of production is high and the manufacturing process is complex, which limits their application, and can only be used for those places which do not pay much attention to economic factors.
Phosphorus containing flame retardant epoxy resin phosphoric ester epoxy resin is an important organic phosphorus series of halogen-free flame retardant epoxy resin, the main chain is connected with epoxy compounds containing phosphoric acid ester and compared to pure resin showed excellent flame retardant performance.
Gao first 2,2- two methyl -1,3- propylene glycol, 1,2- dichloromethane and phosphorus trichloride 5,5- two methyl -2- oxidation -1,3,2- two oxygen phosphorus heterocyclic hexane compounds were synthesized by 4- (DODP), the synthesis of DODP, 1,2- and p- were benzoquinone (5,5- two -2- -1,3,2- two oxygen oxidation of methyl -4- has phosphorusheterocycle oxy) - phenol (DODPP), and finally through the DODPP and EP synthesis of phosphorous EP. Pure bisphenol A type EP (DGEBA) and EP with different phosphorus content were cured by low molecular weight polyimide (PI).
The cured EP system through the TGA test showed that the phosphorus EP system has good thermal stability; when w (P) =2.5% system, carbon residue at 1000 DEG C rate was 46%, while the pure EP at 900 DEG C is only 7%; the LOI (oxygen index) reached 30.2%, and the latter only 19.8%. Therefore, the curing system has good thermal stability and flame retardancy. At the same time, the low molecular weight PI endows the system with higher toughness and impact strength.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
http://www.yaruichem.com
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