News Details
Epoxy resin curing agent
2017-2-18 20:45:10
Epoxy resin curing agent, a kind of transparent brown viscous liquid, soluble in acetone, ethanol, xylene and other organic solvents, slightly soluble in water, with low toxicity.
Epoxy resin curing agent molecules containing active hydrogen of the fatty amine molecules, and can promote the catalysis, the epoxy resin curing group and benzene ring structure. Compared with fatty amine, with strong hydrophobic, in 0 ℃ or so low temperature curing epoxy resin, and can completely in the relative humidity is more than 90% or underwater curing of epoxy resin.
Quality indicators:
1. Appearance: transparent brown viscous liquid
2. The amine value: 460-480 mgkoh/g
3. The relative density of 1.05 0.09 (25 ℃)
4. Viscosity mPa. 25 ℃ s / 400-1000 by GB2794
Main use: epoxy resin curing agent has good corrosion resistance, resistance to permeability, curing speed, high bonding strength, easy operation, low cost, etc, is to carry on the ship, acid, alkali, salt container, underground oil and gas pipeline, the mine equipment and etc; Waterproof engineering with low temperature, high temperature, underwater construction bare homework; During the chemical equipment and pipeline without a stop leak repair ideal curing agent, also can be used as structure adhesive components and electronic components of the potting material. In petroleum, chemical, fertilizer, gas plant, reservoir, mining, shipbuilding, steel, paint, construction, electronics, etc all can use.
This resin is a kind of modified amine curing agent of epoxy resin, and the epoxy resin, toughening agent and cooperate after curing, has low toxicity and fast curing at room temperature, high bonding strength and the characteristics of high hardness, its insulation, water resistant, oil resistant, acid-proof, alkali resistance, wear resistance and good resistance to chemical modification, is widely used in mechanical, chemical, shipbuilding, construction, adhesive, anticorrosion coating, casting, etc. Technical indicators: amine value mgKOH/g 460 or higher viscosity acuity 0.5 mpa. The ratio of s / 25 ℃, advice, three materials: (E44, for example) epoxy resin for A component, T - 31 as B component summer A: B = 100:20-35 winter A: B = 100:25 to 35, packing: packing: 25 kg, 220 kg A barrel.
1, when using the AB components could join: (below are for reference only) toughening agent: p phthalate butyl ester, furfuryl alcohol, liquid thiokol diluent such as: alcohol, acetone, etc., to join with suitable for brushing advisable
2, construction glue volume shoulds not be too large.
3, stored in a dry ventilated place, seal preservation.
2. T - 31 as curing agent of the alkali resistance of epoxy mastic (weight) :
6101 epoxy 100
T - 31 curing agent 10 to 20
Anhydrous ethanol 10 to 20
Phthalic acid dibutyl 6 ~ 8
Diabase powder (120 mesh) 10 ~ 15
Chinese name: Diethyl toluene diamine(DETDA)
Chinese alias: aryl, aryl diethyl - aryl - methyl-p-phenylenediamine
English name: Benzenediamine, ar, ar-diethyl-ar-methyl-English aliases:Diethyltoluenediamine; ar, ar-Diethyl-ar-methylbenzenediamine;Diethylmethylbenzenediamine;
CAS No. :68479-98-1
EINECS No. :270 -877-4
Molecular formula: C11H18N2
Molecular Weight: 178.28
Boiling point: 310 ℃
Refractive index: 1.581
Flash Point: > 140 ℃
Inchi: InChI = 1/C11H18N2/c1-4-8-6-7 (3) 10 (12) 11 (13) 9 (8) 5-2/h6H ,4-5,12-13H2 ,1-3H3 density : 1.022
Risk Codes: R10; R35
RIDADR: UN 3082
Safety instructions: S2; S26; S39; S61
Packing Group: III
Hazard Class: 6.1
Epoxy resin curing agent T - 31 is a kind of integrated high performance phenolic amine curing agent, because it has the activity such as hydroxyl and amine and secondary amino base structure, so the good should be active, and because it contains phenolic skeleton structure, so after crosslinking with epoxy resin to further improve the heat resistance and corrosion resistance of the epoxy resin itself is insufficient, it on the application has the following features:
1, belongs to the non-toxic firming agent, to achieve non-toxic construction
2, can be solidified at room temperature
3, and wide range of the ratio of epoxy resin, and the general dosage is 100 grams of epoxy resin with T - 31 20-30 grams, such as under the condition of low temperature can be mentioned 25 to 40 grams
4, suitable period relatively moderate, easy operation, suitable for large area construction 5, the curing of physical, chemical, comprehensive performance is good
Second, the use ratio of process, for example:
1, 44, 100 grams of adhesive E - T - 30 grams of 31 25 grams of silicon powder
2, 100 g laminated E - 51 T - 31 g anhydrous ethanol 0 g 26
3, anticorrosive coating E - 44 100 grams of T - 31 20 to 25 grams of acetone and toluene 5-15 g, stupid dimethyl, acid dibutyl 3-5 grams, silicon powder 10-15 g
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
Epoxy resin curing agent molecules containing active hydrogen of the fatty amine molecules, and can promote the catalysis, the epoxy resin curing group and benzene ring structure. Compared with fatty amine, with strong hydrophobic, in 0 ℃ or so low temperature curing epoxy resin, and can completely in the relative humidity is more than 90% or underwater curing of epoxy resin.
Quality indicators:
1. Appearance: transparent brown viscous liquid
2. The amine value: 460-480 mgkoh/g
3. The relative density of 1.05 0.09 (25 ℃)
4. Viscosity mPa. 25 ℃ s / 400-1000 by GB2794
Main use: epoxy resin curing agent has good corrosion resistance, resistance to permeability, curing speed, high bonding strength, easy operation, low cost, etc, is to carry on the ship, acid, alkali, salt container, underground oil and gas pipeline, the mine equipment and etc; Waterproof engineering with low temperature, high temperature, underwater construction bare homework; During the chemical equipment and pipeline without a stop leak repair ideal curing agent, also can be used as structure adhesive components and electronic components of the potting material. In petroleum, chemical, fertilizer, gas plant, reservoir, mining, shipbuilding, steel, paint, construction, electronics, etc all can use.
This resin is a kind of modified amine curing agent of epoxy resin, and the epoxy resin, toughening agent and cooperate after curing, has low toxicity and fast curing at room temperature, high bonding strength and the characteristics of high hardness, its insulation, water resistant, oil resistant, acid-proof, alkali resistance, wear resistance and good resistance to chemical modification, is widely used in mechanical, chemical, shipbuilding, construction, adhesive, anticorrosion coating, casting, etc. Technical indicators: amine value mgKOH/g 460 or higher viscosity acuity 0.5 mpa. The ratio of s / 25 ℃, advice, three materials: (E44, for example) epoxy resin for A component, T - 31 as B component summer A: B = 100:20-35 winter A: B = 100:25 to 35, packing: packing: 25 kg, 220 kg A barrel.
1, when using the AB components could join: (below are for reference only) toughening agent: p phthalate butyl ester, furfuryl alcohol, liquid thiokol diluent such as: alcohol, acetone, etc., to join with suitable for brushing advisable
2, construction glue volume shoulds not be too large.
3, stored in a dry ventilated place, seal preservation.
2. T - 31 as curing agent of the alkali resistance of epoxy mastic (weight) :
6101 epoxy 100
T - 31 curing agent 10 to 20
Anhydrous ethanol 10 to 20
Phthalic acid dibutyl 6 ~ 8
Diabase powder (120 mesh) 10 ~ 15
Chinese name: Diethyl toluene diamine(DETDA)
Chinese alias: aryl, aryl diethyl - aryl - methyl-p-phenylenediamine
English name: Benzenediamine, ar, ar-diethyl-ar-methyl-English aliases:Diethyltoluenediamine; ar, ar-Diethyl-ar-methylbenzenediamine;Diethylmethylbenzenediamine;
CAS No. :68479-98-1
EINECS No. :270 -877-4
Molecular formula: C11H18N2
Molecular Weight: 178.28
Boiling point: 310 ℃
Refractive index: 1.581
Flash Point: > 140 ℃
Inchi: InChI = 1/C11H18N2/c1-4-8-6-7 (3) 10 (12) 11 (13) 9 (8) 5-2/h6H ,4-5,12-13H2 ,1-3H3 density : 1.022
Risk Codes: R10; R35
RIDADR: UN 3082
Safety instructions: S2; S26; S39; S61
Packing Group: III
Hazard Class: 6.1
Epoxy resin curing agent T - 31 is a kind of integrated high performance phenolic amine curing agent, because it has the activity such as hydroxyl and amine and secondary amino base structure, so the good should be active, and because it contains phenolic skeleton structure, so after crosslinking with epoxy resin to further improve the heat resistance and corrosion resistance of the epoxy resin itself is insufficient, it on the application has the following features:
1, belongs to the non-toxic firming agent, to achieve non-toxic construction
2, can be solidified at room temperature
3, and wide range of the ratio of epoxy resin, and the general dosage is 100 grams of epoxy resin with T - 31 20-30 grams, such as under the condition of low temperature can be mentioned 25 to 40 grams
4, suitable period relatively moderate, easy operation, suitable for large area construction 5, the curing of physical, chemical, comprehensive performance is good
Second, the use ratio of process, for example:
1, 44, 100 grams of adhesive E - T - 30 grams of 31 25 grams of silicon powder
2, 100 g laminated E - 51 T - 31 g anhydrous ethanol 0 g 26
3, anticorrosive coating E - 44 100 grams of T - 31 20 to 25 grams of acetone and toluene 5-15 g, stupid dimethyl, acid dibutyl 3-5 grams, silicon powder 10-15 g
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
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Isopropylphenyl Phosphate(IPPP50)
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Tris(2-chloroisopropyl)Phosphate(TCPP)
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Triphenyl Phosphite (TPPI)
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Triphenyl Phosphate (TPP)
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Triethyl Phosphate (TEP)
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4-Chlorobenzoic acid (PBCA)
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Dimethyl thiotoluene diamine(DMTDA)
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Diethyl toluene diamine(DETDA)
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9-anthracene
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Trimethyl Phosphate (TMP)
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Isopropylphenyl Phosphate(IPPP65)
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Antioxidant Stabilizers|Defoamers|Penetrants
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Isopropylphenyl Phosphate(IPPP35)
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Tris(2-butoxyethyl)phosphate(TBEP)
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Trixylyl Phosphate(TXP)
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4,4'-Methylenebis(N-sec-butylaniline)-MDBA
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Diphenyl Isooctyl Phosphate-DPOP-S141
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Diphenyl Isodecyl Phosphate-DPDP-S148
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Cresyl Diphenyl Phosphate(CDP)
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Tris(1,3-Dichloro-2-Propyl)Phosphate
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Curing Agents|Chain Extenders|Crosslinking Agents
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2,2-Bis(Hydroxymethyl)Propionic Acid|DMPA
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Poly(1,4-Butanediol) Bis(4-Aminobenzoate)|P-1000
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3-Hydroxyethyloxyethyl-1-Hydroxyethylbenzenediene
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1,3-Bis(2-Hydroxyethoxy)Benzene|HER-Solid
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Chain Extender HQEE-Liquid
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Hydroquinone Bis(2-Hydroxyethyl)Ether|HQEE-Solid
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4,4'-Methylene-bis (3-chloro-2,6-diethylaniline)
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Alicyclic Amine Curing Agent Chain Extender HTDA
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Triallyl Isocyanurate|Crosslinker TAIC
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2,2-Bis(Hydroxymethyl)Butyric Acid|DMBA
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4,4'-Methylenebis(2-Ethylbenzenamine)|MOEA
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4,4'-Methylenebis(2,6-diethylaniline)|MDEA
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4,4'-Methylenebis(2-ethyl-6-methylaniline)|MMEA
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4,4'-Diaminodicyclohexyl Methane|PACM,HMDA
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Cycloaliphatic Curing Agent Chain Extender MACM
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3-Chloro-3'-Ethyl-4,4'-Diaminodiphenylmethane
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Flame Retardants|Plasticizers
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Isopropylphenyl Phosphate(IPPP95)
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Trihexyl Phosphate(THP)
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Triisobutyl Phosphate (TIBP)
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1-Phenyl-3-Methyl-5-Pyrazolone(PMP)
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Tris(2-chloroethyl)phosphate(TCEP)
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