Epoxy flame retardant
Epoxy flame retardant
9, 10- dihydro-9-oxygen-10-phosphone-10-oxide (DOPO) derivatives are of important value in the development and application of epoxy resin.
Currently one of research hot flame retardant epoxy resin is the introduction of new DOPO derivatives in epoxy resin instead of bromine compounds, achieve the goal of halogen-free flame retardant, mainly concentrated in two aspects: DOPO derivatives as a reactive flame retardant epoxy resin, resin matrix introduced ring structure, then through get phosphorous epoxy resin curing; With DOPO derivatives as the curing agent, the ordinary epoxy resin was cured and formed with phosphorous epoxy resin.
DOPO derivatives are used as flame retardants of epoxy resin and can be regarded as a key point in the application of epoxy resin. Domestic researchers will DOPO (I) and itaconic acid, maleic acid and benzoquinone reaction by three Ⅱ DOPO derivatives, Ⅲ and Ⅳ. Findings will I ~ Ⅳ reaction to get high performance epoxy resin and epoxy resin, curing after the product has high Tg, Td, and high elastic modulus and good flame retardancy, suitable for printed circuit board and semiconductor packaging.
Although the carbonation rate and LOI value of 4 kinds of phosphorous epoxy resin were significantly increased, Tg decreased due to the decrease of crosslinking density of cured epoxy resin after adding phosphorous flame retardant.
Td is relatively low but are much higher than 300 ℃, can meet the requirement for the heat stability of the base material (> 288 ℃), and higher than 450 ℃ temperature range, the degradation rate of phosphorous epoxy resin slower than the phosphorous epoxy resin, research suggests that when heated to the phosphorus group first degradation of resin residue rich in phosphorus, it is helpful to improve the degradation of epoxy resin temperature, to prevent further degradation of epoxy resin, and eventually lead to high carbon rate.
Trimethyl phosphate (TMP)
Trimethyl phosphate TMP raw material is three phosphorus oxychloride with methanol in the presence of potassium carbonate reaction of Trimethyl phosphate. At the same time, the reaction of two with methyl phosphoric acid potassium salt, sulfuric acid two methyl ester reaction of Trimethyl phosphate. Trimethyl phosphate crude product after washing, bleaching, dehydration, vacuum distillation was finished. The consumption of raw material: three phosphorus oxychloride 1094kg/t, methanol 686kg/t.
Trimethyl phosphate (TMP) use is mainly used in medicine, pesticides, solvents and extractants, used as a solvent, extraction, determination of zirconium and GC stationary liquid, the ester is used in medicine and pesticide solvent and extractant. Pesticide intermediates. In Japan, Trimethyl phosphate use as anti stain of textile oil and polymer, flame retardant additive for lithium ion battery.
Trimethyl phosphate is currently the main market in India, mostly for textile auxiliaries, the products are mainly exported to Japan, South Korea, Thailand, India.
As of Trimethyl phosphate use need to do not understand, please contact us!
When the phosphorus content of samples containing 4 kinds of flame retardants is more than 1%, the flame retardant level can reach the v-0 level. American experts in this field are] put forward A new type of flame retardant V, it formed by DOPO and naphthoquinone reaction, the phosphorus cured epoxy resin show than tetrabromobisphenol A (TBBA) curing epoxy resin higher thermal stability and carbon rate.
Although these two types of flame retardant epoxy resin, has good flame retardant (UL - 94 - V - a level 0), including V type epoxy resin is TBBA type epoxy resin with high Td, Tg, coal rate and bending strength and no molten drops during combustion, no smoke, that phosphorus than brominated epoxy resin epoxy resin has obvious advantages, the phosphorus curing epoxy resin can be used as a semiconductor packaging materials.
Flame retardant Ⅵ is derived from Ⅳ react with epoxy chloropropane, which have been the phosphorous epoxy resin has high thermal stability and flame retardancy, Tg at 181 ℃, Td is 363 ℃ (N2, 10% weight loss), 700 ℃ when the coal rate is 48% (N2), the phosphorus content as low as 1.03% (in contrast to the bromine content of 7.24%), can achieve UL - 94 - v - a level 0, the LOI value of 30 (but when phosphorus content more than 2.1% when the LOI value can reach a stable level). It can be used to make electronic packaging materials with bisphenol A epoxy resin.
Product 2 initial decomposition temperature of 80 ℃, the weightlessness is probably the product contains a small amount of water loss caused; Its biggest decomposition rate of the corresponding temperature is 236.3 ℃, only a weightless interval, basic decomposition completely at 500 ℃. And 1 of the initial decomposition temperature 283.3 ℃, respectively, the corresponding temperature of 297 ℃ maximum decomposition rate; Compared with 2, it has two quick weight loss range (280-280 ℃ to 330 ℃, 380 ℃), explain pentaerythritol product have higher thermal stability.
This is due to the high molecular weight of pentaerythritol products and good heat resistance. After 600 ℃ decomposition residual carbon content of 23.7%, that it has good into carbon, which is associated with the carbon skeleton structure of raw materials, in the expansion type flame retardant system can have very good into carbon effect, is a kind of potential excellent flame retardant performance. In addition, as can be seen from the DSC results, the m.p. 1 and 2 were 52.9 ℃, 232.8 ℃. There is only one heat absorption peak, which indicates that the product has higher purity.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
http://www.yaruichem.com
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Isopropylphenyl Phosphate(IPPP50)
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Tris(2-chloroisopropyl)Phosphate(TCPP)
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Triphenyl Phosphite (TPPI)
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Triphenyl Phosphate (TPP)
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Triethyl Phosphate (TEP)
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4-Chlorobenzoic acid (PBCA)
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Dimethyl thiotoluene diamine(DMTDA)
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Diethyl toluene diamine(DETDA)
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9-anthracene
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Trimethyl Phosphate (TMP)
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Isopropylphenyl Phosphate(IPPP65)
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Antioxidant Stabilizers|Defoamers|Penetrants
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Isopropylphenyl Phosphate(IPPP35)
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Tris(2-butoxyethyl)phosphate(TBEP)
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Trixylyl Phosphate(TXP)
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4,4'-Methylenebis(N-sec-butylaniline)-MDBA
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Diphenyl Isooctyl Phosphate-DPOP-S141
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Diphenyl Isodecyl Phosphate-DPDP-S148
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Cresyl Diphenyl Phosphate(CDP)
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Tris(1,3-Dichloro-2-Propyl)Phosphate
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Curing Agents|Chain Extenders|Crosslinking Agents
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2,2-Bis(Hydroxymethyl)Propionic Acid|DMPA
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Poly(1,4-Butanediol) Bis(4-Aminobenzoate)|P-1000
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3-Hydroxyethyloxyethyl-1-Hydroxyethylbenzenediene
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1,3-Bis(2-Hydroxyethoxy)Benzene|HER-Solid
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Chain Extender HQEE-Liquid
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Hydroquinone Bis(2-Hydroxyethyl)Ether|HQEE-Solid
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4,4'-Methylene-bis (3-chloro-2,6-diethylaniline)
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Alicyclic Amine Curing Agent Chain Extender HTDA
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Triallyl Isocyanurate|Crosslinker TAIC
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2,2-Bis(Hydroxymethyl)Butyric Acid|DMBA
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4,4'-Methylenebis(2-Ethylbenzenamine)|MOEA
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4,4'-Methylenebis(2,6-diethylaniline)|MDEA
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4,4'-Methylenebis(2-ethyl-6-methylaniline)|MMEA
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4,4'-Diaminodicyclohexyl Methane|PACM,HMDA
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Cycloaliphatic Curing Agent Chain Extender MACM
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3-Chloro-3'-Ethyl-4,4'-Diaminodiphenylmethane
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Flame Retardants|Plasticizers
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Isopropylphenyl Phosphate(IPPP95)
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Trihexyl Phosphate(THP)
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Triisobutyl Phosphate (TIBP)
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1-Phenyl-3-Methyl-5-Pyrazolone(PMP)
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Tris(2-chloroethyl)phosphate(TCEP)
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- News List
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It ACTS as an auxiliary antiox -
The properties of phenolic ant -
Amine antioxidants -
Thermoplastic anti-oxygen agen -
Plastic auxiliary antioxidant -
Molecular structure of antioxi -
High polymer antioxidants -
General-purpose plastic antiox -
Phosphoric acid ester auxiliar -
Antioxidant compound products -
Polypropylene complex antioxid -
Compatibility of antioxidants -
Industrial plastic composite a -
An antioxidant for polymers -
PVC resin antioxidant