News Details
Crosslinking agent of epoxy coating
2017-3-13 17:21:45
Crosslinking agent of epoxy coating,Epoxy resin adhesive and epoxy coating is on the basis of the epoxy resin reprocessing or modification on their characteristics, make its performance parameters meet certain requirements, such as epoxy resin adhesive and epoxy coatings usually also needs to have crosslinking agent to use collocation, and need to completely after mixing crosslinking, general epoxy resin adhesive is called A glue or main agent, crosslinking agent called B or rubber crosslinking agent (hardener).
Reflect the epoxy resin adhesive crosslinking in front of the main features are: color, viscosity, specific gravity, ratio, gel time, can use time, crosslinking time, thixotropy flow (check), hardness, surface tension, etc.
Viscosity (Viscosity) : refers to the colloid in the flow generated by the internal friction resistance, its value is determined by the factors such as types of material, temperature, concentration.
Gel time: glue the crosslinking process, from the transformation of liquid to the crosslinking reaction when a colloid to solid starting glue criticality of time to gel time, it is composed of epoxy resin adhesive mixing amount, temperature and other factors.
Thixotropy: this feature is refers to the colloid from external touches (shaking, mixing, vibration, ultrasonic, etc.), along with the external force from thick to thin, when external factors to stop action, colloid and restore to the original consistency of the phenomenon.
Hardness (Hardness) : refers to material for stamping, external force such as scratch resistance. According to different test methods have shaw (Shore), Brinell hardness (Brinell, Rockwell hardness (Rockwell) hardness, Morse (Mohs), pap (Barcol hardness, vickers hardness (Vichers) hardness, etc.
Hardness values associated with hardness tester type, in the commonly used hardness tester, shaw hardness tester structure is simple, suitable for production, inspection, shaw hardness tester can be classified as type A, C, D, A model for measuring the soft colloid, C and D type used for measuring the semi-hard and hard colloid.
Surface tension (Surface recogniton) : liquid internal appeal made on the Surface of the molecules in the inward under the action of a force, this force causes the liquid to minimize the Surface area and the formation of a parallel to the Surface force, called Surface tension.
Or the liquid surface between adjacent two parts per unit length in the mutual traction, it is one of the molecular force performance. Surface tension is the unit of N/m. The size of the surface tension of related to the nature of the liquid, purity, and temperature.
Chinese name: Diethyl toluene diamine(DETDA)
Diethyltoluenediamine Raw material :
TDA industrial, Sichuan production
Ethylene (Et) polymer grade, Shanghai production
TEA industrial imports
A reagent grade additives
Epoxy resin is referring to molecule contains two or more than two epoxide group of organic compounds, in addition to the individual, their relative molecular quality is not high. The molecular structure of the epoxy resin based on molecular chain containing lively epoxy groups for its characteristics, epoxy groups can be placed at the end of the chain, or into a ring structure in the middle.
Due to contain active epoxy group in the molecular structure, make them with multiple types of crosslinking agent and crosslinking reaction to form insoluble with three to the network structure of polymer. Every containing epoxy groups in the molecular structure of polymer compounds are collectively referred to as epoxy resin.
After cross-linked epoxy resin has good physical and chemical properties, on the surface of the metal and nonmetal material has excellent bonding strength, good dielectric properties, setting small shrinkage, drying products good dimensional stability, high hardness, good flexibility, the alkali stability and most solvents. Therefore widely used in casting, impregnation, laminated materials, adhesives, coatings and other purposes.
Due to the high insulation of the epoxy resin, structural strength and sealing performance is good wait for many special advantages, has been in the insulation of the high and low voltage electrical appliances, electrical and electronic components and is widely used on packaging, developing very quickly.
Epoxy coating is often used in the electronic level of epoxy molding compound used in the semiconductor components encapsulation. Consciousness to fast. Because of its superior performance, to replace the traditional metal, ceramic and glass packaging trends.
In addition, epoxy insulating coatings, adhesives and electrical insulating adhesives also has a large number of applications.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
Diethyl toluene diamine(DETDA) http://www.yaruichem.com
Reflect the epoxy resin adhesive crosslinking in front of the main features are: color, viscosity, specific gravity, ratio, gel time, can use time, crosslinking time, thixotropy flow (check), hardness, surface tension, etc.
Viscosity (Viscosity) : refers to the colloid in the flow generated by the internal friction resistance, its value is determined by the factors such as types of material, temperature, concentration.
Gel time: glue the crosslinking process, from the transformation of liquid to the crosslinking reaction when a colloid to solid starting glue criticality of time to gel time, it is composed of epoxy resin adhesive mixing amount, temperature and other factors.
Thixotropy: this feature is refers to the colloid from external touches (shaking, mixing, vibration, ultrasonic, etc.), along with the external force from thick to thin, when external factors to stop action, colloid and restore to the original consistency of the phenomenon.
Hardness (Hardness) : refers to material for stamping, external force such as scratch resistance. According to different test methods have shaw (Shore), Brinell hardness (Brinell, Rockwell hardness (Rockwell) hardness, Morse (Mohs), pap (Barcol hardness, vickers hardness (Vichers) hardness, etc.
Hardness values associated with hardness tester type, in the commonly used hardness tester, shaw hardness tester structure is simple, suitable for production, inspection, shaw hardness tester can be classified as type A, C, D, A model for measuring the soft colloid, C and D type used for measuring the semi-hard and hard colloid.
Surface tension (Surface recogniton) : liquid internal appeal made on the Surface of the molecules in the inward under the action of a force, this force causes the liquid to minimize the Surface area and the formation of a parallel to the Surface force, called Surface tension.
Or the liquid surface between adjacent two parts per unit length in the mutual traction, it is one of the molecular force performance. Surface tension is the unit of N/m. The size of the surface tension of related to the nature of the liquid, purity, and temperature.
Chinese name: Diethyl toluene diamine(DETDA)
Diethyltoluenediamine Raw material :
TDA industrial, Sichuan production
Ethylene (Et) polymer grade, Shanghai production
TEA industrial imports
A reagent grade additives
Epoxy resin is referring to molecule contains two or more than two epoxide group of organic compounds, in addition to the individual, their relative molecular quality is not high. The molecular structure of the epoxy resin based on molecular chain containing lively epoxy groups for its characteristics, epoxy groups can be placed at the end of the chain, or into a ring structure in the middle.
Due to contain active epoxy group in the molecular structure, make them with multiple types of crosslinking agent and crosslinking reaction to form insoluble with three to the network structure of polymer. Every containing epoxy groups in the molecular structure of polymer compounds are collectively referred to as epoxy resin.
After cross-linked epoxy resin has good physical and chemical properties, on the surface of the metal and nonmetal material has excellent bonding strength, good dielectric properties, setting small shrinkage, drying products good dimensional stability, high hardness, good flexibility, the alkali stability and most solvents. Therefore widely used in casting, impregnation, laminated materials, adhesives, coatings and other purposes.
Due to the high insulation of the epoxy resin, structural strength and sealing performance is good wait for many special advantages, has been in the insulation of the high and low voltage electrical appliances, electrical and electronic components and is widely used on packaging, developing very quickly.
Epoxy coating is often used in the electronic level of epoxy molding compound used in the semiconductor components encapsulation. Consciousness to fast. Because of its superior performance, to replace the traditional metal, ceramic and glass packaging trends.
In addition, epoxy insulating coatings, adhesives and electrical insulating adhesives also has a large number of applications.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
Diethyl toluene diamine(DETDA) http://www.yaruichem.com
-
Isopropylphenyl Phosphate(IPPP50)
-
-
Tris(2-chloroisopropyl)Phosphate(TCPP)
-
-
Triphenyl Phosphite (TPPI)
-
-
Triphenyl Phosphate (TPP)
-
-
Triethyl Phosphate (TEP)
-
-
4-Chlorobenzoic acid (PBCA)
-
-
Dimethyl thiotoluene diamine(DMTDA)
-
-
Diethyl toluene diamine(DETDA)
-
-
9-anthracene
-
-
Trimethyl Phosphate (TMP)
-
-
Isopropylphenyl Phosphate(IPPP65)
-
-
Antioxidant Stabilizers|Defoamers|Penetrants
-
-
Isopropylphenyl Phosphate(IPPP35)
-
-
Tris(2-butoxyethyl)phosphate(TBEP)
-
-
Trixylyl Phosphate(TXP)
-
-
4,4'-Methylenebis(N-sec-butylaniline)-MDBA
-
-
Diphenyl Isooctyl Phosphate-DPOP-S141
-
-
Diphenyl Isodecyl Phosphate-DPDP-S148
-
-
Cresyl Diphenyl Phosphate(CDP)
-
-
Tris(1,3-Dichloro-2-Propyl)Phosphate
-
-
Curing Agents|Chain Extenders|Crosslinking Agents
-
-
2,2-Bis(Hydroxymethyl)Propionic Acid|DMPA
-
Poly(1,4-Butanediol) Bis(4-Aminobenzoate)|P-1000
-
3-Hydroxyethyloxyethyl-1-Hydroxyethylbenzenediene
-
1,3-Bis(2-Hydroxyethoxy)Benzene|HER-Solid
-
Chain Extender HQEE-Liquid
-
Hydroquinone Bis(2-Hydroxyethyl)Ether|HQEE-Solid
-
4,4'-Methylene-bis (3-chloro-2,6-diethylaniline)
-
Alicyclic Amine Curing Agent Chain Extender HTDA
-
Triallyl Isocyanurate|Crosslinker TAIC
-
2,2-Bis(Hydroxymethyl)Butyric Acid|DMBA
-
4,4'-Methylenebis(2-Ethylbenzenamine)|MOEA
-
4,4'-Methylenebis(2,6-diethylaniline)|MDEA
-
4,4'-Methylenebis(2-ethyl-6-methylaniline)|MMEA
-
4,4'-Diaminodicyclohexyl Methane|PACM,HMDA
-
Cycloaliphatic Curing Agent Chain Extender MACM
-
3-Chloro-3'-Ethyl-4,4'-Diaminodiphenylmethane
-
-
Flame Retardants|Plasticizers
-
-
Isopropylphenyl Phosphate(IPPP95)
-
-
Trihexyl Phosphate(THP)
-
-
Triisobutyl Phosphate (TIBP)
-
-
1-Phenyl-3-Methyl-5-Pyrazolone(PMP)
-
-
Tris(2-chloroethyl)phosphate(TCEP)
-
- News List
-
It ACTS as an auxiliary antiox -
The properties of phenolic ant -
Amine antioxidants -
Thermoplastic anti-oxygen agen -
Plastic auxiliary antioxidant -
Molecular structure of antioxi -
High polymer antioxidants -
General-purpose plastic antiox -
Phosphoric acid ester auxiliar -
Antioxidant compound products -
Polypropylene complex antioxid -
Compatibility of antioxidants -
Industrial plastic composite a -
An antioxidant for polymers -
PVC resin antioxidant