News Details
A new type of epoxy resin flame retardant
2017-11-5 22:57:38
A new type of epoxy resin flame retardant
9, 10- two hydrogen -9- oxo -10- phosphine phenanthrene -10- oxide (DOPO) derivative, has important value in the development and application of epoxy resin.
One of the new type epoxy resin flame retardant epoxy resin is the research hotspot in the introduction of new DOPO derivatives substituted bromine compounds, to achieve the purpose of halogen-free flame retardant, mainly concentrated in two aspects: DOPO derivatives as reaction type epoxy resin flame retardant resin matrix, the ring structure, obtained by solidifying epoxy resin; with DOPO derivatives as curing agent, epoxy curing agent will form phosphorus containing epoxy resin.
DOPO derivatives as novel flame retardant epoxy resin, can be said to be one of the key applications of epoxy resin. Domestic researchers will DOPO (I) respectively with itaconic acid, maleic acid and benzoquinone reaction of 3 kinds of DOPO derivatives II, III and IV. It is found that the epoxy resin can be obtained by reaction of I to epoxy resin. The cured product has high Tg, Td, high elastic modulus and good flame retardancy. It is suitable for printed circuit board and semiconductor package.
Although the 4 kinds of phosphorus containing epoxy resin char yield and LOI value were significantly increased, but Tg decreased due to the crosslinking density of epoxy resin cured with phosphorus containing flame retardant after reducing sake; although Td is relatively low but are far higher than 300 DEG C, can satisfy the thermal stability of the substrate requirements (>288 C), and in the temperature range above 450 DEG C, the degradation rate of phosphorus containing epoxy resin is much slower than the non phosphorus epoxy resin to research that residues when heated in the first group containing phosphorus resin degradation form rich in phosphorus, it helps to improve the degradation temperature of epoxy resin, epoxy resin to prevent further degradation, and eventually lead to high char yield.
When the content of phosphorus containing 4 kinds of flame retardant samples of more than 1%, the flame retardant level can reach V-0 grade. American experts in this regard is put forward for flame retardant V model, which consists of DOPO and naphthaquinone reaction formation, the phosphorus containing epoxy resin after curing performance than four tetrabromobisphenol A (TBBA) type thermal stability of cured epoxy resin and higher char yield.
Tris (1,3-Dichloro-2-Propyl) Phosphate (Flame Retardant TDCPP)
Product Name: Tris (1,3-Dichloro-2-Propyl) Phosphate; Tris (1,3-Dichloroisopropyl) Phosphate; Tris (1,3-Dichloroisopropyl) Phosphate; (1,3-Dichloro-2-Propyl) Phosphate; Tris (1,3-Dichloroisopropyl) Phosphate; Tris (1,3-Dichloroisopropyl) Tris (1,3-Dichloro-2-Propyl) Phosphate (TDCPP); TCPP Tris (2-Chloropropyl) Phosphate, Flame Retardant TDCPP
1,3-Dichloro-2-Propanolphosphate (3: 1); 1,3-Dichloro-2-Propanolophosphate (3: 1) 2-Propanol, 1,3-Dichloro, Phosphate (3: 1); 2-Propanol, 1,3-Dichloro-, Phosphate (3: 1) ); Crp (Fireproofingagent); Emulsion 212
CAS No.:13674-87-8
EINECS Number: 237-159-2
Molecular Formula: C9H15Cl6O4P
Molecular Weight: 430.9
Tris (1,3-Dichloro-2-Propyl) Phosphate (Flame Retardant TDCPP) Use:
The Product Has A High Efficiency Flame Retardant, Low Volatility, High Thermal Stability, Water Resistance, Alkali Stable And Soluble In Most Organic Substances, Processing Performance, With Plastic, Moisture, Anti-Static, Anti-Pull, Anti-Compression Performance. Widely Used In Unsaturated Polyester, Polyurethane Foam, Epoxy Resin, Phenolic Resin, Rubber, Soft Polyvinyl Chloride, Synthetic Fibers And Other Plastics And Coatings At High Temperature Pyrolysis, Can Be Used As Emulsifier And Explosion-Proof Agent.
Although the 2 types of flame retardant epoxy resin has good flame resistance (UL-94 V-0), containing V epoxy resin containing a TBBA epoxy resin with high Td, Tg, char yield and the bending strength and the combustion no droplet, no smoke released, that has a phosphorus containing epoxy resin obvious advantages than brominated epoxy resin, the curing epoxy resin can be used as semiconductor packaging materials.
The flame retardant is obtained by IV VI reacts with epichlorohydrin, thermal stability and flame retardancy of epoxy resin obtained by it have high: Tg 181 C, 363 C (Td N2, 10%, weightlessness) at 700 DEG charring rate was 48% (N2), the phosphorus content as low as 1.03% (in contrast to the bromine content of 7.24%), you can reach the UL-94V-0 level, LOI value is 30 (but when phosphorus content exceeds 2.1% LOI value will reach a stable level). It can be used for electronic packaging materials and bisphenol A epoxy resin mixture.
2 of the initial product decomposition temperature is 80 DEG C, the loss may be caused by evaporation of water containing a small amount of product; the maximum decomposition rate corresponding to the temperature of 236.3 DEG C, only a weightless, at 500 DEG C is decomposed completely. While 1 of the initial decomposition temperature was 283.3 degrees, the maximum decomposition rate of the corresponding temperature is 297 DEG C; compared to 2, it has two quick weight loss interval (280 DEG -330 DEG C, 330-380), it shows that the thermal stability of pentaerythritol product with higher.
This is due to the molecular pentaerythritol production quantity is big, good heat resistance; at 600 DEG C after the decomposition of residual carbon content was 23.7%, indicating that it has a good effect of carbon, this relates to the raw carbon skeleton, in intumescent flame retardant system can play a very good charring effect, is a kind of flame retardant the potential of excellent performance. In addition, from the results of DSC can be seen in the 1 and 2 M.P. respectively, 52.9 C, 232.8 C. They are only one endothermic peak, indicating high purity product.
Two kinds of Flame Retardants Containing 1 and 2 were synthesized from polyols, and recrystallization was purified by using suitable solvents. TG-DSC analysis showed that 1 had good heat resistance and char formation, and could be used as a good flame retardant.
Study on the influence of sample quality, pump speed, dispersion time, dispersing medium, dispersing agent and dispersant concentration and other factors on the results of particle size distribution measurement of flame retardant magnesium hydroxide powder by MS2000 laser particle size analyzer. The suitable conditions were: 700mL water as the dispersion medium, detergent dispersant agent, dispersant concentration control in 0.1 ~ 0.3g / L, magnesium hydroxide powder samples ranged from 0.020 to 0.035g, the pump speed is 1400 ~ 2000r / min, ultrasonic time is 2 ~ 5min, the ultrasonic measurement immediately after dispersion.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
http://www.yaruichem.com
9, 10- two hydrogen -9- oxo -10- phosphine phenanthrene -10- oxide (DOPO) derivative, has important value in the development and application of epoxy resin.
One of the new type epoxy resin flame retardant epoxy resin is the research hotspot in the introduction of new DOPO derivatives substituted bromine compounds, to achieve the purpose of halogen-free flame retardant, mainly concentrated in two aspects: DOPO derivatives as reaction type epoxy resin flame retardant resin matrix, the ring structure, obtained by solidifying epoxy resin; with DOPO derivatives as curing agent, epoxy curing agent will form phosphorus containing epoxy resin.
DOPO derivatives as novel flame retardant epoxy resin, can be said to be one of the key applications of epoxy resin. Domestic researchers will DOPO (I) respectively with itaconic acid, maleic acid and benzoquinone reaction of 3 kinds of DOPO derivatives II, III and IV. It is found that the epoxy resin can be obtained by reaction of I to epoxy resin. The cured product has high Tg, Td, high elastic modulus and good flame retardancy. It is suitable for printed circuit board and semiconductor package.
Although the 4 kinds of phosphorus containing epoxy resin char yield and LOI value were significantly increased, but Tg decreased due to the crosslinking density of epoxy resin cured with phosphorus containing flame retardant after reducing sake; although Td is relatively low but are far higher than 300 DEG C, can satisfy the thermal stability of the substrate requirements (>288 C), and in the temperature range above 450 DEG C, the degradation rate of phosphorus containing epoxy resin is much slower than the non phosphorus epoxy resin to research that residues when heated in the first group containing phosphorus resin degradation form rich in phosphorus, it helps to improve the degradation temperature of epoxy resin, epoxy resin to prevent further degradation, and eventually lead to high char yield.
When the content of phosphorus containing 4 kinds of flame retardant samples of more than 1%, the flame retardant level can reach V-0 grade. American experts in this regard is put forward for flame retardant V model, which consists of DOPO and naphthaquinone reaction formation, the phosphorus containing epoxy resin after curing performance than four tetrabromobisphenol A (TBBA) type thermal stability of cured epoxy resin and higher char yield.
Tris (1,3-Dichloro-2-Propyl) Phosphate (Flame Retardant TDCPP)
Product Name: Tris (1,3-Dichloro-2-Propyl) Phosphate; Tris (1,3-Dichloroisopropyl) Phosphate; Tris (1,3-Dichloroisopropyl) Phosphate; (1,3-Dichloro-2-Propyl) Phosphate; Tris (1,3-Dichloroisopropyl) Phosphate; Tris (1,3-Dichloroisopropyl) Tris (1,3-Dichloro-2-Propyl) Phosphate (TDCPP); TCPP Tris (2-Chloropropyl) Phosphate, Flame Retardant TDCPP
1,3-Dichloro-2-Propanolphosphate (3: 1); 1,3-Dichloro-2-Propanolophosphate (3: 1) 2-Propanol, 1,3-Dichloro, Phosphate (3: 1); 2-Propanol, 1,3-Dichloro-, Phosphate (3: 1) ); Crp (Fireproofingagent); Emulsion 212
CAS No.:13674-87-8
EINECS Number: 237-159-2
Molecular Formula: C9H15Cl6O4P
Molecular Weight: 430.9
Tris (1,3-Dichloro-2-Propyl) Phosphate (Flame Retardant TDCPP) Use:
The Product Has A High Efficiency Flame Retardant, Low Volatility, High Thermal Stability, Water Resistance, Alkali Stable And Soluble In Most Organic Substances, Processing Performance, With Plastic, Moisture, Anti-Static, Anti-Pull, Anti-Compression Performance. Widely Used In Unsaturated Polyester, Polyurethane Foam, Epoxy Resin, Phenolic Resin, Rubber, Soft Polyvinyl Chloride, Synthetic Fibers And Other Plastics And Coatings At High Temperature Pyrolysis, Can Be Used As Emulsifier And Explosion-Proof Agent.
Although the 2 types of flame retardant epoxy resin has good flame resistance (UL-94 V-0), containing V epoxy resin containing a TBBA epoxy resin with high Td, Tg, char yield and the bending strength and the combustion no droplet, no smoke released, that has a phosphorus containing epoxy resin obvious advantages than brominated epoxy resin, the curing epoxy resin can be used as semiconductor packaging materials.
The flame retardant is obtained by IV VI reacts with epichlorohydrin, thermal stability and flame retardancy of epoxy resin obtained by it have high: Tg 181 C, 363 C (Td N2, 10%, weightlessness) at 700 DEG charring rate was 48% (N2), the phosphorus content as low as 1.03% (in contrast to the bromine content of 7.24%), you can reach the UL-94V-0 level, LOI value is 30 (but when phosphorus content exceeds 2.1% LOI value will reach a stable level). It can be used for electronic packaging materials and bisphenol A epoxy resin mixture.
2 of the initial product decomposition temperature is 80 DEG C, the loss may be caused by evaporation of water containing a small amount of product; the maximum decomposition rate corresponding to the temperature of 236.3 DEG C, only a weightless, at 500 DEG C is decomposed completely. While 1 of the initial decomposition temperature was 283.3 degrees, the maximum decomposition rate of the corresponding temperature is 297 DEG C; compared to 2, it has two quick weight loss interval (280 DEG -330 DEG C, 330-380), it shows that the thermal stability of pentaerythritol product with higher.
This is due to the molecular pentaerythritol production quantity is big, good heat resistance; at 600 DEG C after the decomposition of residual carbon content was 23.7%, indicating that it has a good effect of carbon, this relates to the raw carbon skeleton, in intumescent flame retardant system can play a very good charring effect, is a kind of flame retardant the potential of excellent performance. In addition, from the results of DSC can be seen in the 1 and 2 M.P. respectively, 52.9 C, 232.8 C. They are only one endothermic peak, indicating high purity product.
Two kinds of Flame Retardants Containing 1 and 2 were synthesized from polyols, and recrystallization was purified by using suitable solvents. TG-DSC analysis showed that 1 had good heat resistance and char formation, and could be used as a good flame retardant.
Study on the influence of sample quality, pump speed, dispersion time, dispersing medium, dispersing agent and dispersant concentration and other factors on the results of particle size distribution measurement of flame retardant magnesium hydroxide powder by MS2000 laser particle size analyzer. The suitable conditions were: 700mL water as the dispersion medium, detergent dispersant agent, dispersant concentration control in 0.1 ~ 0.3g / L, magnesium hydroxide powder samples ranged from 0.020 to 0.035g, the pump speed is 1400 ~ 2000r / min, ultrasonic time is 2 ~ 5min, the ultrasonic measurement immediately after dispersion.
Copyright: Zhang Jia Gang YaRui Chemical co.,Ltd
http://www.yaruichem.com
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Isopropylphenyl Phosphate(IPPP50)
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Tris(2-chloroisopropyl)Phosphate(TCPP)
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Triphenyl Phosphite (TPPI)
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Triphenyl Phosphate (TPP)
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Triethyl Phosphate (TEP)
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4-Chlorobenzoic acid (PBCA)
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Dimethyl thiotoluene diamine(DMTDA)
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Diethyl toluene diamine(DETDA)
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9-anthracene
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Trimethyl Phosphate (TMP)
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Isopropylphenyl Phosphate(IPPP65)
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Antioxidant Stabilizers|Defoamers|Penetrants
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Isopropylphenyl Phosphate(IPPP35)
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Tris(2-butoxyethyl)phosphate(TBEP)
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Trixylyl Phosphate(TXP)
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4,4'-Methylenebis(N-sec-butylaniline)-MDBA
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Diphenyl Isooctyl Phosphate-DPOP-S141
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Diphenyl Isodecyl Phosphate-DPDP-S148
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Cresyl Diphenyl Phosphate(CDP)
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Tris(1,3-Dichloro-2-Propyl)Phosphate
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Curing Agents|Chain Extenders|Crosslinking Agents
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2,2-Bis(Hydroxymethyl)Propionic Acid|DMPA
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Poly(1,4-Butanediol) Bis(4-Aminobenzoate)|P-1000
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3-Hydroxyethyloxyethyl-1-Hydroxyethylbenzenediene
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1,3-Bis(2-Hydroxyethoxy)Benzene|HER-Solid
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Chain Extender HQEE-Liquid
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Hydroquinone Bis(2-Hydroxyethyl)Ether|HQEE-Solid
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4,4'-Methylene-bis (3-chloro-2,6-diethylaniline)
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Alicyclic Amine Curing Agent Chain Extender HTDA
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Triallyl Isocyanurate|Crosslinker TAIC
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2,2-Bis(Hydroxymethyl)Butyric Acid|DMBA
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4,4'-Methylenebis(2-Ethylbenzenamine)|MOEA
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4,4'-Methylenebis(2,6-diethylaniline)|MDEA
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4,4'-Methylenebis(2-ethyl-6-methylaniline)|MMEA
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4,4'-Diaminodicyclohexyl Methane|PACM,HMDA
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Cycloaliphatic Curing Agent Chain Extender MACM
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3-Chloro-3'-Ethyl-4,4'-Diaminodiphenylmethane
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Flame Retardants|Plasticizers
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Isopropylphenyl Phosphate(IPPP95)
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Trihexyl Phosphate(THP)
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Triisobutyl Phosphate (TIBP)
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1-Phenyl-3-Methyl-5-Pyrazolone(PMP)
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Tris(2-chloroethyl)phosphate(TCEP)
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